AT&S Receives HELLA Innovation Award

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HELLA, an internationally operating German automotive supplier, has honoured particularly innovative suppliers. Numerous companies from various industries took part in the new “HELLA Co-Innovation Platform” (HIP) competition and presented their innovation proposals to a jury consisting of members of the Electronics executive board and further experts. Following an extensive evaluation, AT&S reached the final with its “PCB Embedded Power” submission, along with two other suppliers. In the innovative concept by AT&S, power components such as MOSFETs are embedded directly in the PCB. A considerable size reduction in a relevant product was demonstrated to HELLA.

“For AT&S, this award from HELLA is an important recognition that we are an innovation driver and expert partner,” said a delighted Heinz Moitzi, AT&S COO. “The award is another step on our way to becoming a provider of comprehensive and powerful interconnect solutions that go far beyond just the circuit board.”

The aim of the HIP competition is to involve particularly innovative suppliers in the early phases of product development and thus jointly advance the development of new, forward-looking technologies. AT&S has now been honoured as a particularly innovative supplier to HELLA at an awards ceremony at the company’s headquarters in Lippstadt. Innovative strength, cost-effectiveness and cooperation potential with regard to HELLA’s product and development portfolio were the winning criteria.

AT&S PCB Embedded Power

Based on the AT&S ECP (embedded components packaging) technology, integrated active and passive components are integrated into PCBs for low-power designs and are used in volume production meeting high-quality requirements. Accordingly, the implementation of power semiconductors like MOSFETs directly into the circuit board (PCB Embedded Power) is a very promising approach for meeting the increasing needs of electromobility and challenging industrial applications. Efficient power packaging solutions and power modules can be implemented in this way. Compared to conventional SMT technology, a space reduction for the power module of 50% can be realized, significantly increasing the power density. In addition, the innovative power packaging technology offers very good results in terms of switching behaviour, heat removal and power cycling robustness.