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New TSN-MACsec IP Core for Secure Data Transmission in 5G/6G Communication Networks

04/15/2025 | Fraunhofer
Reliability and security in broadband communication networks (5G/6G) are crucial for meeting the challenges of the digital future. Together with aconnic AG, Fraunhofer IPMS has developed an innovative IP core as part of the “RealSec5G” project, which combines the advantages of a MACsec IP core with those of a Time-Sensitive Networking (TSN) IP core.

AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Capital Expo & Tech Forum

04/11/2025 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Capital Expo & Tech Forum taking place on May 8 at George Mason University – Mason Square in Arlington, Virginia.

NASA’s Advancements in Space Continue Generating Products on Earth

02/14/2025 | NASA JPL
NASA’s Jet Propulsion Laboratory developed or collaborated on multiple technologies highlighted in the agency’s annual publication focused on commercial infusions.

Lockheed Martin to Modernize Air Force F-22 Raptor with Advanced Infrared Threat-Detection Sensors

01/22/2025 | Lockheed Martin
Lockheed Martin has received a $270 million contract from the U.S. Air Force to integrate a system of next-generation infrared defensive sensors on the F-22 Raptor. 

NAMICS Brings Innovative Thermoset Materials to PCB Fabrication

01/16/2025 | Andy Shaughnessy, Design007 Magazine
At PCB Carolina, Matt Lake and Ken Araujo of NAMICS Technologies spoke with Andy Shaughnessy about the introduction of an innovative thermoset material to PCB fabrication. This groundbreaking material, originally developed for the semiconductor packaging industry, addresses a longstanding demand for unreinforced thermoset films that enhance dielectric properties in PCB applications and allow for manufacturing the very finest of features, 0.002" and below.
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