Aismalibar to Attend 'Advancements in Thermal Management' Conference
July 29, 2019 | AismalibarEstimated reading time: 2 minutes
Aismalibar is pleased to announce its attendance at this year’s “Advancements in Thermal Management” in Denver, Colorado on August 7 and 8. The conference brings together design engineers, academia, system engineers, material scientists, CTOs and R&D managers with organizations in industries and markets whose products, operations and services require precise control of thermal properties and states.
The Advancements in Thermal Management event shows attendees the latest advances in thermal management and temperature mitigation, addressing topics such as electronic packaging, air and liquid refrigeration, heat pipes, thermal materials / TIMS, detection and control of temperature, design and management of the system for the optimization of thermal properties.
Aismalibar will attend the event as an exhibitor and showcase the following products:
COBRITHEM Insulate Metal Substrates are produced with a variety of thicknesses of both aluminum or copper and can be clad with different mixtures of dielectric layers to meet the ever-changing demands of the industry. The material can be produced in a variety of styles ranging from thin layers as small as 50 microns to ensure excellent thermal impedance and up to 130 microns, allowing it to withstand high insulation in between the conductive metal layer.
COBRITHERM ULTRATHIN integrates an innovative ultra-thin dielectric layer that provides higher thermal performance, excellent working temperature and reduces thermal resistance. The new COBRITHERM ULTRA THIN 4W Tg of 180ºC and an 150ºC MOT offers industry leading thermal conductivity, strong MOT values, High Tg and Low CTE which are the key elements for performance of MPCBs operating at high temperatures
FASTHERM is a unique product developed to achieve a faster thermal transition from the LED thermal pad to the heat sink. This superior thermal transition can be achieved by using the entire COBRITHERM HTC product range with either a copper or copper-aluminum base. By using Aismalibar COBRITHERM HTC range together with FASTHERM technology, LEDs operate at a temperature 30ºC to 50ºC lower due to the direct thermal transition from the thermal pad to the heat sink.
FLEXTHERM is a high technology thermal IMS for use in the production of conformable metal printed circuit boards that can be bent without compromising the initial dielectric strength between conductive layers. Its low thermal impedance allows the dissipation of temperature from the heating elements of a PCB into FLEXTHERM’s metal core at an extremely efficient rate.
As thermal management becomes more challenging on multilayer PCBs constructions, AISMALIBAR has developed different substrates that can be combined to offer tailored solutions. These substrates are required in the case of complex boards with denser circuitry.
About Aismalibar
Founded in 1934 and based in Barcelona, Spain, Aismalibar manufactures high end Copper and Metal Clad Laminates for the Printed Circuit Board Industry. Aismalibar’s expertise lies in offering the best solutions to reduce the operational temperature of the printed circuit boards. Aismalibar materials ensure quality and reliability of all the products that incorporate them. Aismalibar has implemented a 100% proof test with 1-3KV (High Pot Test) to every IMS laminate that is produced. These materials minimize the use of supplementary fans or heat sinks, thus reducing production costs. Aismalibar now operates globally through several subsidiaries. Our priorities are now, and have always been technological innovation and customer satisfaction.
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.