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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Statement of the Global Electronics Association on USTR’s Section 301 Forced Labor Action

07/28/2026 | Global Electronics Association
The Global Electronics Association shares the Administration’s objective. Forced labor has no place in the electronics supply chain, and our industry has spent years building the tools to find and remove it.

NVIDIA, Broadcom Ramp CPO Switch Production

07/27/2026 | TrendForce
TrendForce's latest research on the optical communications industry reveals that NVIDIA has begun shipping its next-generation Spectrum-X CPO switch to select partners.

QuinStar Technology Ranked #24 Among Southern California’s Top Aerospace & Defense Companies

07/08/2026 | QuinStar Technology, Inc.
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Knocking Down the Bone Pile: The Business Case for Component Reclamation

06/23/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Electronic waste is increasing globally at an alarming rate. By 2030, it is estimated that the world will generate approximately 82 million tons of electronic waste per year. Rapid technological advances, shorter product lifecycles, and supply chain disruptions often lead manufacturers to build bloated inventories of electronic products. Unfortunately, some of this inventory ends up as electronic waste when components become obsolete or surplus to forecasted requirements, including high-value devices.

Deswell Announces Second Half and Full Year Fiscal 2026 Results

06/17/2026 | BUSINESS WIRE
Net sales for the six months ended March 31, 2026 were $28.1 million, a decrease of 13.4% compared to net sales of $32.4 million for the six months ended March 31, 2025.
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