SAFI-Tech's No-Heat SAC305 Receives Investment from Rhapsody Venture Partners
August 9, 2019 | PRNewswireEstimated reading time: 2 minutes
The electronics manufacturing world has long been searching for a low-heat or no-heat solder solution. Advanced electronics designs with lightweight flexible substrates or sensitive miniaturized components require a dramatic reduction in processing heat while still meeting high operating temperature requirements. SAFI-Tech's patented platform allows for SAC305, the market standard, to be processed at temperatures as low as ambient.
SAFI-Tech encapsulates liquid SAC305 in a nanofilm that prevents the alloy from solidifying when cooled below its melting point. SAFI-Tech's no-heat SAC305 alloy is processed at low temperatures and forms the same metallic interconnects as current SAC305 processed at above 260°C.
Said Carsten Boers, managing partner at Rhapsody Venture Partners: "When we first encountered SAFI-Tech two years ago, we were skeptical that you could encapsulate a molten metal with a nanofilm at 230°C, and maintain its liquid form as it was cooled to room temperature. The team has made incredible strides in the past year, the technology works and is robust."
SAFI-Tech's platform and IP were developed at Iowa State University by company co-founders Professor Martin Thuo and Dr. Ian Tevis. Rhapsody's investment follows SAFI-Tech's significant developments on a no-heat SAC305. Rhapsody is providing funding and is partnering with the executive team to bring the SAFI-Tech solution to market. The company is initiating a roadshow with the goal of forming a consortium of partnerships to make SAFI-Tech's no-heat SAC305 the new standard in electronics for conductive interconnects.
Said Professor Martin Thuo and Dr. Ian Tevis, company co-founders: "SAFI-Tech is at a major inflection point in its company growth, and Rhapsody's investment and partnership is coming at just the right time. Wherever we go, industry veterans are amazed at the capabilities of our technology and the possibilities it enables."
About SAFI-Tech
SAFI-Tech produces no-heat solders for use in electronics manufacturing and assembly. SAFI-Tech's alloy consists of tiny supercooled metal particles that are liquid at room temperature. When activated, the liquid metal flows and solidifies, creating full-metal conductive interconnects. Removing heat from electronics manufacturing enables smaller, thinner, and flexible designs, currently unachievable with standard materials and processes. In addition to enabling fundamental design innovation, the removal of heat creates economic value by reducing manufacturing costs and increasing throughput. Learn more at http://www.safi-tech.com.
About Rhapsody Venture Partners
Rhapsody Venture Partners is a venture investor in Cambridge, MA that funds early-stage applied science and engineering companies. Rhapsody's team works side-by-side with entrepreneurs to engage anchor customers that reduce time-to-commercialization and accelerate growth. Learn more at http://www.rhapsodyvp.com
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.