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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

It’s Only Common Sense: Every Salesperson Must Become a Teacher

10/26/2026 | Dan Beaulieu -- Column: It's Only Common Sense
Customers do not need more sales pitches. They need more clarity.  They are trying to navigate material shortages, component constraints, changing tariffs, longer lead times, new technologies, geopolitical uncertainty, and the enormous demands AI is placing on the electronics supply chain. Every day brings another warning, and much of the information is contradictory, exaggerated, or so technical that it creates more confusion than understanding.

Trouble in your Tank: Are PCB Fabricators Ready for the Next Technology Curve?

10/26/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry’s demand for smaller, faster, and more powerful devices is driving major advances in PCB manufacturing. One of the central priorities is to increase circuit density while maintaining performance and reliability. Manufacturers produce finer lines and spaces so more components can fit on smaller, more sophisticated boards. They are also refining SMT features to support tighter pitches without compromising performance.

Zhen Ding Highlights AI and Global Mass Production in Advanced PCB Competition

10/23/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leader in PCB manufacturing, participated in the “TPCA Show Trends Forum” at the 2026 TPCA Show.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/23/2026 | Marcy LaRont, I-Connect007
In my top five must-read items from this week’s articles and news, I am focusing on the interconnect because, honestly, who isn’t? We are in the interconnect business, and it just gets more complex and more fun every day. My interview with MKS Inc.’s Dr. John Lee and the accompanying article, which breaks down the technology, implications of current market realities, and their effect on the state of “the interconnect,” is my first choice this week.

Qnity Advances Interconnect Innovations for Next-Generation Smart Consumer Electronics

10/22/2026 | Qnity
Qnity Electronics, Inc. introduces ultra-thin flex circuit materials that help enable the next generation of smart consumer electronics, including smartphones, AI glasses, and AR/VR devices, through advanced materials innovations that deliver exceptional bendability, mechanical performance, and reliability for advanced interconnect applications.
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