GW4 Supercomputer Isambard Can Compete with Intel
August 15, 2019 | University of BristolEstimated reading time: 2 minutes
Researchers from GW4 Universities Bristol and Cardiff assessed the performance of the GW4 Alliance Isambard supercomputer using an open-source Large-Eddy Simulation (LES) code. The research team consisted of Unai Lopez Novoa, Data Innovation Research Institute; Pablo Ouro Barba, Cardiff School of Engineering; Dr James Price, University of Bristol and Professor Simon McIntosh Smith, the principal investigator for the Isambard project and a professor of high-performance computing at the University of Bristol.
Isambard was designed by GW4 Alliance researchers in partnership with the Met Office and global supercomputer leader Cray Inc.
Isambard is composed of two sets of nodes: one small set based on widely used x86 Intel chips, and another much larger set that uses novel 64-bit ARM-based Cavium ThunderX2 processors. The latter is the first of a series of ARM-based computing chips for High Performance Computing (HPC) systems.
To assess the performance of Isambard Cray, the researchers used Hydro3D, a state-of-the-art code developed by a team from Cardiff University’s Hydro-environmental Research Centre. The code can simulate complex turbulent flows in Hydraulic or Environmental Engineering, fluid-structure interaction problems in Aeronautical Engineering or design of renewable energy devices.
The first tests conducted were evidence of the huge potential in using ARM-based HPC systems in the field of Computational Fluid Dynamics, with Hydro3D performing better in the ARM-based processors. During the tests, the novel processor behaved correctly and without error, showing the readiness of the new ARM-based ecosystem to be used in a production environment.
Isambard is the first Arm-based supercomputer in the world to go into production use, and the largest Arm-based system outside of the U.S. Isambard is now being used for scientific research as well as to explore future computer architectures in the exascale era. It is part of the EPSRC-funded Tier-2 High-Performance Computing ecosystem in the UK.
Future work in this direction will focus on further profiling and tuning of Hydro3D in the ARM-based processors and assessing the performance and scalability in multi-node simulations.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
More Than Electrical Test: TTCI to Spotlight X-ray and CT Capabilities at SMTA Capital Expo
05/07/2026 | TTCIThe Training Connection LLC (TTC-LLC) will exhibit at the SMTA Capital Expo on Thursday, May 14 at the DoubleTree by Hilton Baltimore - BWI Airport.
The Test Connection, Inc. Adds Experienced Test Engineer to Expand Flying Probe and ICT Capabilities
05/06/2026 | The Training Connection LLCThe Training Connection LLC (TTC-LLC) has hired Hermes Gonzalez as a Test Development Engineer, adding deep experience in flying probe and in-circuit test (ICT) to its engineering team.
Next Generation Microelectronics: AT&S Honors Top Apprentices
05/04/2026 | AT&SThe Austrian high-tech company AT&S is a global player in the world of microelectronics. Driven in particular by the boom in applications related to artificial intelligence (AI), IC substrates and high-tech printed circuit boards from AT&S are currently in strong demand.
SAIC Wins $75.2M PRISM Task Order for Naval Aviation Systems Support
05/04/2026 | SAICScience Applications International Corp. has been awarded a new $75.2 million task order under the General Services Administration (GSA) Personnel and Readiness Infrastructure Support Management (PRISM) contract to provide critical support to the Naval Air Systems Command (NAVAIR).
Everspin Executes $40M Agreement for Mil-Aero MRAM Applications
04/30/2026 | Everspin Technologies, Inc.Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.