DARPA Making Progress on Miniaturized Atomic Clocks for Future PNT Applications
August 22, 2019 | DARPAEstimated reading time: 5 minutes
Honeywell’s integrated photonic chip technology not only reduces the size, weight, and power of laser delivery systems, but also allows for batch fabrication of complex optical systems with reduced manufacturing cost.
Figure 2: Silicon chip with waveguides and gratings to create a 3D laser beam pattern. In the photo, the light-guiding channels glow from the light they are directing, and the invisible 3D beams coming out of the chip are indicated by a computer-rendered overlay. Source: Honeywell
Finally, a team from NASA’s Jet Propulsion Laboratory (JPL), with support from researchers at SRI International; University of California, Davis; and University of Illinois Urbana-Champaign, has demonstrated an experimental atomic clock capable of meeting ACES’ target metrics, while proving immune to temperature and environmental issues. Building off research that created the Deep Space Atomic Clock (DSAC), the team developed an ion-based approach to atom cooling that relies on ionized mercury and ultraviolet lamps instead of lasers. The JPL atomic clock showed an immunity of less than 1 part in 14 decimal places for 1 degree Celsius change. To put that in perspective, that is about 100x better than current CSACs. The use of mercury ions also provides more stability while making the technology less sensitive to magnetic fields and temperature changes.
Figure 3: This photo is of the ACES 10 cc package developed by researchers from NASA’s JPL. Source: NASA Jet Propulsion Laboratory
As evidenced by the NIST and Honeywell research, progress on the ACES program is generating new means of fabricating atomic clock technologies at wafer scale, which makes continued exploration more cost effective and less reliant on massive engineering endeavors. “Today, we are dealing with complicated optical systems that require massive amounts of engineering whenever you want to iterate on a design. The early progress made on ACES shows that there are viable options in development for doing this same thing without the massive engineering manpower or hefty costs associated with current approaches,” noted Burke.
Page 2 of 2Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.