Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
MKS Instruments Sells Newest ESI Laser Processing System to Cicor
August 27, 2019 | Globe NewswireEstimated reading time: 3 minutes
MKS Instruments has sold a recently introduced ESI CapStone printed circuit board (PCB) laser processing systems to Cicor. Cicor, a leading European manufacturer of highly-complex PCB and hybrid circuits, is the first European PCB company to invest in MKS’ latest-generation ESI UV laser drilling technology. The new CapStone system, placed in Cicor’s facility in Boudry, Switzerland, leverages CapStone’s new beam positioning technology to help Cicor serve the increasing customer demand for processing blind and through hole vias in flexible printed circuits (FPC).
The CapStone system’s patented technology enables copper opening and dielectric cleaning in a single pass, rather than the multiple passes required by other systems. The ESI AcceleDrill™, MKS’ newest generation beam positioning technology, enables CapStone systems to take advantage of the high power and high repetition rate of the system’s new laser to deliver unprecedented processing efficiency.
“We’re excited to be the first to have the CapStone system in Europe,” said Christophe Sipp, Process Engineering Manager of the Cicor site in Boudry. In order for us to stay ahead, we need to deliver quality and quick turnaround times. Being the first to leverage CapStone’s precision and throughput will give us an advantage in a competitive market.”
“We’re seeing strong market acceptance for CapStone globally,” said John Williams, vice president of marketing, ESI Products. “Our customers are pressed to increase processing efficiency while controlling costs. The new technology deployed in CapStone not only enables them to gain those efficiencies, but also provides the flexibility to deal with new materials in production.”
The ESI brand represents an innovator in laser-based manufacturing solutions for the micro-machining and micro-electronic industries, and the CapStone system is optimized for the flexible printed circuits widely used in consumer electronics, such as smartphones and other handheld devices. The system delivers the highest productivity available, while maintaining high levels of accuracy and precision in critical parameters such as via diameter and placement.
About MKS Instruments
MKS Instruments, Inc. is a global provider of instruments, subsystems and process control solutions that measure, monitor, deliver, analyze, power and control critical parameters of advanced manufacturing processes to improve process performance and productivity for our customers. Our products are derived from our core competencies in pressure measurement and control, flow measurement and control, gas and vapor delivery, gas composition analysis, residual gas analysis, leak detection, control technology, ozone generation and delivery, power, reactive gas generation, vacuum technology, lasers, photonics, sub-micron positioning, vibration control and optics. We also provide services related to the maintenance and repair of our products, installation services and training. Our primary served markets include semiconductor, industrial technologies, life and health sciences, research and defense. Additional information can be found at www.mksinst.com.
About ESI
ESI is a brand within the MKS Instruments Equipment & Solutions Division. The ESI portfolio consists of laser-based micro manufacturing systems and component test systems that are used worldwide by manufacturers in the electronics industry to process the materials and components that are an integral part of the electronic devices and systems in use today. Leveraging over 40 years of laser-material interaction expertise and applied laser technology, ESI solutions enable customers to optimize production by providing more control, greater application flexibility and more precise processing of a wide range of materials. The result is higher production quality, increased throughput and higher back-end yields at a lower total cost-of-ownership. Additional information can be found at www.esi.com.
About Cicor
The Cicor Group is a globally active development and manufacturing partner with innovative technology solutions for the electronics industry. With about 2,000 employees at ten production sites, Cicor offers highly complex printed circuit boards and hybrid circuits as well as comprehensive electronic manufacturing services (EMS) including microelectronic assembly and plastic injection molding. Cicor supplies customized products and services—from design to the finished product—from one source.
Share on:
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.