Flexible Thinking: Rules of Thumb: A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
MKS Instruments Sells Newest ESI Laser Processing System to Cicor
August 27, 2019 | Globe NewswireEstimated reading time: 3 minutes
MKS Instruments has sold a recently introduced ESI CapStone printed circuit board (PCB) laser processing systems to Cicor. Cicor, a leading European manufacturer of highly-complex PCB and hybrid circuits, is the first European PCB company to invest in MKS’ latest-generation ESI UV laser drilling technology. The new CapStone system, placed in Cicor’s facility in Boudry, Switzerland, leverages CapStone’s new beam positioning technology to help Cicor serve the increasing customer demand for processing blind and through hole vias in flexible printed circuits (FPC).
The CapStone system’s patented technology enables copper opening and dielectric cleaning in a single pass, rather than the multiple passes required by other systems. The ESI AcceleDrill™, MKS’ newest generation beam positioning technology, enables CapStone systems to take advantage of the high power and high repetition rate of the system’s new laser to deliver unprecedented processing efficiency.
“We’re excited to be the first to have the CapStone system in Europe,” said Christophe Sipp, Process Engineering Manager of the Cicor site in Boudry. In order for us to stay ahead, we need to deliver quality and quick turnaround times. Being the first to leverage CapStone’s precision and throughput will give us an advantage in a competitive market.”
“We’re seeing strong market acceptance for CapStone globally,” said John Williams, vice president of marketing, ESI Products. “Our customers are pressed to increase processing efficiency while controlling costs. The new technology deployed in CapStone not only enables them to gain those efficiencies, but also provides the flexibility to deal with new materials in production.”
The ESI brand represents an innovator in laser-based manufacturing solutions for the micro-machining and micro-electronic industries, and the CapStone system is optimized for the flexible printed circuits widely used in consumer electronics, such as smartphones and other handheld devices. The system delivers the highest productivity available, while maintaining high levels of accuracy and precision in critical parameters such as via diameter and placement.
About MKS Instruments
MKS Instruments, Inc. is a global provider of instruments, subsystems and process control solutions that measure, monitor, deliver, analyze, power and control critical parameters of advanced manufacturing processes to improve process performance and productivity for our customers. Our products are derived from our core competencies in pressure measurement and control, flow measurement and control, gas and vapor delivery, gas composition analysis, residual gas analysis, leak detection, control technology, ozone generation and delivery, power, reactive gas generation, vacuum technology, lasers, photonics, sub-micron positioning, vibration control and optics. We also provide services related to the maintenance and repair of our products, installation services and training. Our primary served markets include semiconductor, industrial technologies, life and health sciences, research and defense. Additional information can be found at www.mksinst.com.
About ESI
ESI is a brand within the MKS Instruments Equipment & Solutions Division. The ESI portfolio consists of laser-based micro manufacturing systems and component test systems that are used worldwide by manufacturers in the electronics industry to process the materials and components that are an integral part of the electronic devices and systems in use today. Leveraging over 40 years of laser-material interaction expertise and applied laser technology, ESI solutions enable customers to optimize production by providing more control, greater application flexibility and more precise processing of a wide range of materials. The result is higher production quality, increased throughput and higher back-end yields at a lower total cost-of-ownership. Additional information can be found at www.esi.com.
About Cicor
The Cicor Group is a globally active development and manufacturing partner with innovative technology solutions for the electronics industry. With about 2,000 employees at ten production sites, Cicor offers highly complex printed circuit boards and hybrid circuits as well as comprehensive electronic manufacturing services (EMS) including microelectronic assembly and plastic injection molding. Cicor supplies customized products and services—from design to the finished product—from one source.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.