Mini LEDs will Continue to See Higher Penetration Rates in High-End Display Markets
September 17, 2019 | TrendForceEstimated reading time: 3 minutes
The latest Mini LED and HDR High-End Display Market Report by LEDinside, a division of TrendForce, reveals that Mini LED backlight displays all have a significant advantage in brightness, reliability and performance, as well as a chance to grab a slice of the high-end display market. It may even extend the lifetime of LCDs. It is predicted that Mini LED backlights in 2024 will enjoy penetration rates of 20%, 15% and 10% in the application markets of ITs, TVs and tablets, respectively.
TrendForce points out that, in comparing the features of OLED and Mini LED backlight displays, the local dimming feature of Mini LED backlight displays may rival OLEDs in their ability to contrast colors. Mini LEDs also have more competitive prices when compared to TV and monitor product applications, since Mini LED backlight displays exhibit display effects nearly equal to those of OLEDs, but the power consumption is much lower than OLED. This means that these products give a better value for money.
EPISTAR Develops Fast Transfer Technology to Enter Mini LED Backlight Market
With the rise of Mini LED backlight technology, the original industry chain changes. For example, panel manufacturers AUO and Innolux are both collaborating with their respective LED companies to develop Mini LED backlight modules: AUO has joined hands with Lextar, while Innolux is already working with companies such as AOT and Epileds, developing towards TV, IT, and small- and medium-sized automotive product applications and hoping to keep their competitive edge in LCD products. CSOT, BOE and others have partaken in Mini LED backlights and display businesses by leveraging their edge in product technology and equipment capex. Chip manufacturer EPISTAR has worked with subsidiary Yenrich to release Mini LED light source modules to enter the backlight applications of high-end display.
The key challenges of Mini LED backlight technology are cost, power consumption and die bonding efficiency. In terms of power consumption challenge, as current mounts and heat along with it, efficiency goes down. So far, EPISTAR has offered two different solutions to help customers meet their goal of reducing power consumption or cost. For power consumption, with the decrease of chip size and drive current, customers can improve full-screen power consumption with enhanced backlight dimming zone control. For cost, EPISTAR added innovative reflector with LED chips to increase the beam angle. So far, EPISTAR has been able to produce LED chips with special beam angle from 150 to 170 degrees to reduce the number of LED chips required as well as system production costs.
In addition, with the reduction of LED chip size and the increase in number, LED die bonding is becoming more and more difficult. EPISTAR and subsidiary Yenrich’s self-developed “Fast Transfer on X substrate” can precisely transfer Mini or Micro LED chips in large quantities on a variety of material substrates specified by customers.
TrendForce suggests that innovations in Mini LED backlight technology may bring advantages in display effect, but the new structure also places a heavier burden in costs, and striking a fine balance between the two has become a problem that suppliers along the whole supply chain must work together to solve. The fastest way to reduce costs would be to combine the strengths of relevant suppliers for backplanes, LED chips and driver ICs and module assembly companies and develop Mini LED products with better value. Mini LED chips will play an important role in that process. Chip suppliers turned market leaders and technological vanguards will hold an even greater advantage in the future.
About TrendForce
TrendForce is a global provider of the latest development, insight, and analysis of the technology industry. Having served businesses for over a decade, the company has built up a strong membership base of 435,000 subscribers. TrendForce has established a reputation as an organization that offers insightful and accurate analysis of the technology industry through five major research divisions: DRAMeXchange, WitsView, LEDinside, EnergyTrend and Topology. Founded in Taipei, Taiwan in 2000, TrendForce has extended its presence in China since 2004 with offices in Shenzhen and Beijing.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.