Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
Facing the Future: Time for Real Talk, Early and Often, Between Design and Fabrication
Trouble in Your Tank: Can You Drill the Perfect Hole?
Atotech to Participate in the 52nd International Symposium on Microelectronics
September 27, 2019 | AtotechEstimated reading time: 1 minute
Atotech will present at the 52nd International Symposium on Microelectronics, held at the Hynes Convention Center in Boston, Massachusetts, from September 30 through October 3, 2019.
The symposium is being organized by the International Microelectronics Assembly and Packaging Society (iMAPS), which is bringing together the entire microelectronics supply chain, and it will feature five technical discussions as well as one interactive poster session.
The iMAPS technical committee is offering over 125 technical presentations and posters on today’s most relevant topics. This year Atotech will participate with two technical paper presentations:
On Tuesday, October 1, from 4:15 – 4:40 p.m., an Atotech semiconductor expert, Dr. Ralf Schmidt, will introduce the company’s latest results on an “Optimized ECD copper RDL process with via filling capability for next generation packaging.” In his presentation at the Wafer Level / Panel Level Symposium (room 208), Dr. Schmidt will elaborate on Spherolyte® Cu UF3 and Spherolyte® Cu VR and their via filling characteristics.
Atotech metallization expert Don Jang will give the second paper presentation on Thursday, October 3, from 10:45 – 11:10 a.m. at the Advanced Package Symposium (room 203). His topic “Nano-void formation at Cu/Cu/Cu interconnections of blind micro vias: a field study” (author: Tobias Bernhard) is highly discussed at the moment and will provide some interesting findings.
Visitors of the symposium are welcome to join Atotech’s paper presentations at the 52nd International Symposium on Microelectronics. Dr. Schmidt and Mr. Jang will be available for questions after their presentations.
About Atotech
Atotech is a global leader in surface-finishing solutions. Through a comprehensive systems-and-solutions approach, the company delivers chemistry, equipment, and service to support diverse industries such as consumer electronics, especially mobile devices and computers; global automotive; communication infrastructure; and many other industrial end-markets. Atotech’s relentless R&D efforts and global TechCenter presence allows it to deliver pioneering and sustainable products combined with unparalleled on-site customer support – making Atotech a critical partner to over 8,000 customers worldwide.
Atotech is a team of 3,800 experts in over 40 countries generating annual revenues of $1.2 billion (2018). Atotech has manufacturing operations across Europe, the Americas, and Asia and its headquarters is located in Berlin, Germany.
For more information about Atotech or its product offering, please visit www.atotech.com.
Share on:
Suggested Items
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
07/09/2025 | Happy Holden -- Column: Happy’s Tech TalkWhen we consider via reliability, the major contributing factors are typically processing deviations. These can be subtle and not always visible. One particularly insightful column was by Mike Carano, “Causes of Plating Voids, Pre-electroless Copper,” where he outlined some of the possible causes of hole defects for both plated through-hole (PTH) and blind vias.
Trouble in Your Tank: Can You Drill the Perfect Hole?
07/07/2025 | Michael Carano -- Column: Trouble in Your TankIn the movie “Friday Night Lights,” the head football coach (played by Billy Bob Thornton) addresses his high school football team on a hot day in August in West Texas. He asks his players one question: “Can you be perfect?” That is an interesting question, in football and the printed circuit board fabrication world, where being perfect is somewhat elusive. When it comes to mechanical drilling and via formation, can you drill the perfect hole time after time?
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.