It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Atotech to Participate in the 52nd International Symposium on Microelectronics
September 27, 2019 | AtotechEstimated reading time: 1 minute
Atotech will present at the 52nd International Symposium on Microelectronics, held at the Hynes Convention Center in Boston, Massachusetts, from September 30 through October 3, 2019.
The symposium is being organized by the International Microelectronics Assembly and Packaging Society (iMAPS), which is bringing together the entire microelectronics supply chain, and it will feature five technical discussions as well as one interactive poster session.
The iMAPS technical committee is offering over 125 technical presentations and posters on today’s most relevant topics. This year Atotech will participate with two technical paper presentations:
On Tuesday, October 1, from 4:15 – 4:40 p.m., an Atotech semiconductor expert, Dr. Ralf Schmidt, will introduce the company’s latest results on an “Optimized ECD copper RDL process with via filling capability for next generation packaging.” In his presentation at the Wafer Level / Panel Level Symposium (room 208), Dr. Schmidt will elaborate on Spherolyte® Cu UF3 and Spherolyte® Cu VR and their via filling characteristics.
Atotech metallization expert Don Jang will give the second paper presentation on Thursday, October 3, from 10:45 – 11:10 a.m. at the Advanced Package Symposium (room 203). His topic “Nano-void formation at Cu/Cu/Cu interconnections of blind micro vias: a field study” (author: Tobias Bernhard) is highly discussed at the moment and will provide some interesting findings.
Visitors of the symposium are welcome to join Atotech’s paper presentations at the 52nd International Symposium on Microelectronics. Dr. Schmidt and Mr. Jang will be available for questions after their presentations.
About Atotech
Atotech is a global leader in surface-finishing solutions. Through a comprehensive systems-and-solutions approach, the company delivers chemistry, equipment, and service to support diverse industries such as consumer electronics, especially mobile devices and computers; global automotive; communication infrastructure; and many other industrial end-markets. Atotech’s relentless R&D efforts and global TechCenter presence allows it to deliver pioneering and sustainable products combined with unparalleled on-site customer support – making Atotech a critical partner to over 8,000 customers worldwide.
Atotech is a team of 3,800 experts in over 40 countries generating annual revenues of $1.2 billion (2018). Atotech has manufacturing operations across Europe, the Americas, and Asia and its headquarters is located in Berlin, Germany.
For more information about Atotech or its product offering, please visit www.atotech.com.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.