Flexible Board Makers See Potential in Mini LED Backlighting
October 3, 2019 | DigitimesEstimated reading time: Less than a minute
With Apple reportedly looking to incorporate mini LED display technology into its iPad and MacBook product lines between the second half of 2020 and first half of 2021, Taiwan-based flexible PCB makers including Zhen Ding Technology and Flexium Interconnect stand a good chance of entering the supporting supply chain.
Flexium has long been in the supply chain of LED backlight modules for iPad and MacBook models, and will be in a better position to win orders should Apple adopt mini LED backlight modules for new iPads and MacBook.
Suggested Items
Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, and Rocket Lab to Expand Production of Chips Critical for U.S. National Security and Space Industry
11/25/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Aeluma Secures NASA Contract to Advance Quantum Dot Photonic Integrated Circuits for Aerospace and AI Applications
11/25/2024 | ACCESSWIREAeluma, Inc., a semiconductor company specializing in high-performance, scalable technologies for mobile, automotive, AI, defense and aerospace, communication and quantum computing, announced it has been awarded a contract by NASA to develop quantum dot photonic integrated circuits (PICs) on silicon.
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in