Tunable Optical Chip Paves Way for New Quantum Devices
October 7, 2019 | OSAEstimated reading time: 5 minutes
Testing the integrated device
The researchers tested the performance of the fabricated integrated microring resonators and microheaters by applying different levels of electrical power and then measuring the optical transmission of the waveguide coupled to the microring resonator. Their results showed that it is possible to achieve high-quality resonators with low-power thermal tunability through a robust device that can be manufactured using existing semiconductor foundry processes.
“Combined with other unique features of our crystalline SiC-on-insulator platform, these high-quality devices have the basic requirements for enabling new chip-scale devices that operate in a wide range of wavelengths,” said Ali Adibi, the team leader. “This chip-scale tunability is essential for performing quantum operations necessary for quantum computing and communication. In addition, because of the biocompatibility of SiC, it could be very useful for in vivo biosensing.”
The researchers are now working to build elements with the crystalline SiC-on-insulator platform for quantum photonic integrated circuits, including on-chip pump lasers, single photon sources and single photon detectors that could be used with the tunable microring resonator to create a fully functional chip for advanced optical quantum computing.
This work is the result of three years of extensive research in forming a reliable hybrid platform with considerably improved SiC material properties and using it for forming innovative devices. Xi Wu, Tianren Fan, and Ali A. Eftekhar in Ali Adibi’s research group contributed immensely to this work. Hesam Moradinejad, a former member of Adibi’s researcher group, also contributed to the platform development (published earlier). This work was primarily funded by the Air Force Office of Scientific Research (AFOSR) under grant number FA9550-15-1-0342 (G. Pomrenke).
About Optics Letters
Optics Letters offers rapid dissemination of new results in all areas of optical science with short, original, peer-reviewed communications. Optics Letters accepts papers that are noteworthy to a substantial part of the optics community. Published by The Optical Society (OSA) and led by Editor-in-Chief Xi-Cheng Zhang, University of Rochester, USA, Optics Letters is available online at OSA Publishing.
About The Optical Society
Founded in 1916, The Optical Society (OSA) is the leading professional organization for scientists, engineers, students and business leaders who fuel discoveries, shape real-life applications and accelerate achievements in the science of light. Through world-renowned publications, meetings and membership initiatives, OSA provides quality research, inspired interactions and dedicated resources for its extensive global network of optics and photonics experts. For more information, visit osa.org.
Page 2 of 2Suggested Items
Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, and Rocket Lab to Expand Production of Chips Critical for U.S. National Security and Space Industry
11/25/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
HPC Customer Engages Sondrel for High End Chip Design
11/25/2024 | SondrelSondrel, a leading provider of ultra-complex custom chips, has announced that it has started front end, RTL design and verification work on a high-performance computing (HPC) chip project for a major new customer.
GlobalFoundries, U.S. Department of Commerce Announce Award Agreement on CHIPS Act Funding for Essential Chip Manufacturing
11/22/2024 | GlobalFoundriesGlobalFoundries (GF) and the U.S. Department of Commerce have announced an award of up to $1.5 billion in direct funding to GF through the CHIPS and Science Act.
SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.