The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
Impending Deployment of 5G Boosts Demand for Data Center Testing Equipment
October 7, 2019 | Frost & SullivanEstimated reading time: 2 minutes
As data centers shift from multifiber push-on (MPO)-8 to MPO-12 and, eventually, MPO-24, the demand for more versatile fiber-optic testing equipment is intensifying. Data centers are also transitioning from 100G to 400G calls for carrier aggregation technologies that enhance the network broadband. To test the Ethernet, data center end users require solutions that can validate FlexE and FlexOtechnologies.
In addition, the migration from large, pedestrian data center infrastructure to smaller, modular, software-defined and virtualized data centers due to a surge in data traffic will enhance the requirement for equipment that can test the data center at a component level. This demand from high-density data centers and the anticipated deployment of 5G are expected to drive the $5.58 billion market toward $11.67 billion by 2024.
“The rollout of 5G will encourage the adoption of underlying technologies such as faster transceivers and Ethernet interfaces which will, in turn, drive the need for equipment and solutions with superior testing and monitoring capabilities,” said Rohan Joy Thomas, Industry Analyst, Measurement & Instrumentation. “As 5G will be engineered to handle higher data transfer speeds and lower latencies, the network infrastructure will have to be re-engineered. This includes upgrading conventional transceivers with faster, more energy-efficient systems, and traditional copper wiring with a denser fiber medium.”
Frost & Sullivan’s recent analysis, Growth Opportunities in the Data Center Test and Measurement Market, Forecast to 2024, presents a holistic view of the data center industry, key drivers for testing & monitoring equipment manufacturers, and the main market challenges. It identifies the testing equipment that is most likely to be used. It also presents the market shares across the regional markets of North America, Europe, Asia-Pacific, and Rest-of-the-World.
“North America is a key region due to the higher market share of solutions used to monitor and manage network performance as well as applications that reside on top of the network,” noted Thomas. “Meanwhile, several emerging markets from Asia-Pacific are expected to play a bigger role in the development of the data center ecosystem. China is making rapid strides in the R&D and production of more powerful chipsets for data centers; this spurt in activities will drive demand for general-purpose testing equipment in the region.”
The changing trends in the data industry create additional growth opportunities for testing equipment manufacturers. For long-term growth, solution providers are likely to:
- Transition from predominantly hardware-based solutions to software-based ones; these can be easily deployed across the mobile edge and across a virtualized network infrastructure
- Provide end users with a complete lifecycle management tool that spans from the device all the way to the network infrastructure
- Offer solutions that can cost-effectively bring on-board business-critical Internet of Things (IoT) applications to the cloud environment
- Engineer a common platform, which is interoperable with application programming interfaces (APIs) and third-party software
- Partner with small Artificial Intelligence (AI) and machine learning (ML) firms
- Deliver relevant, software-defined solutions that can be used to validate the hyper-converged infrastructure (HCI)
- Create solutions that data center operators can use to optimize their infrastructure and check the compliance of augmented/virtual reality (AR/VR) devices and applications on their networks
- Collaborate with leading cloud computing service companies to offer testing solutions in the cloud environment
About Frost & Sullivan
For over five decades, Frost & Sullivan has become world-renowned for its role in helping investors, corporate leaders and governments navigate economic changes and identify disruptive technologies, Mega Trends, new business models and companies to action, resulting in a continuous flow of growth opportunities to drive future success.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.
How Good Design Enables Sustainable PCBs
08/21/2025 | Gerry Partida, Summit InterconnectSustainability has become a key focus for PCB companies seeking to reduce waste, conserve energy, and optimize resources. While many discussions on sustainability center around materials or energy-efficient processes, PCB design is an often overlooked factor that lies at the heart of manufacturing. Good design practices, especially those based on established IPC standards, play a central role in enabling sustainable PCB production. By ensuring designs are manufacturable and reliable, engineers can significantly reduce the environmental impact of their products.