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Real Time with… IPC APEX EXPO 2024: Transitioning Into Automation With DIS

05/08/2024 | Real Time with...IPC APEX EXPO
Publisher Barry Matties and DIS Sales Director Jesse Ziomek discuss the company's shift toward automation, tackling issues such as limited floor space and integration costs while showcasing the advantages their SAM automation system has to offer. Also discussed are workforce challenges and return on investment considerations. As Jesse states, "DIS's goal is to offer solutions for smaller shops," and underscores the user-friendly, no-integration-costs aspect of their system.

Real Time with… IPC APEX EXPO 2024: Circuit Board Testing Strategies and the Impact of AI

05/08/2024 |
Editor Marcy LaRont speaks with Bert Horner, president of The Test Connection, about the importance of strategic planning and design-for-test (DFT). Bert touches on some common mistakes that occur when DFT is not adequately considered early on. The discussion outlines an overarching industry need for a culture shift toward increasingly higher levels of integration and collaboration. Bert mentions that AI now has an influence on testing, as everywhere else, and announces his forthcoming book.

Siemens Delivers New Solido IP Validation Suite

05/07/2024 | Siemens
Siemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.

Real Time with… IPC APEX EXPO 2024: Aegis Software Partners With Arch Systems

04/29/2024 | Real Time with...IPC APEX EXPO
Jason Spera, CEO of Aegis Software, discusses the company's collaboration with Arch Systems to develop the Aria X2 Bridge, a tool designed to boost continuous improvement. Spera delves into how Arch's AI enhances the work of human engineers, the harmonious relationship between Arch and Aegis, the integration process, and the customer experience. As Spera explains, the integration of Factory Logics and the Aria Bridge is simple, benefiting existing Factory Logics customers with pre-existing seed data.

iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging

04/26/2024 | iNEMI
Advanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
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