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Nordson: Protecting Yield as Packaging Complexity Grows

11/12/2026 | Marcy LaRont, I-Connect007
As AI and high-performance computing push advanced packaging toward greater complexity, manufacturers must expand capacity while protecting yield on increasingly valuable assemblies. At SEMICON West, Nordson Electronic Solutions’ Jeanine Norlin, senior manager of marketing, and Liam Thorp, product line manager, discuss how the company is addressing those demands through plasma surface treatment and precision dispensing. They explain how plasma improves wettability and underfill flow, how the ASYMTEK Vantage XL handles large-panel warpage, and why coordinated process expertise across Nordson’s businesses is becoming more important for manufacturing reliability.

Koh Young’s Answer to Wafer-level Inspection Challenges

11/12/2026 | Marcy LaRont, I-Connect007
At SEMICON West, I caught up with Allen Phung, head of sales at Koh Young America, where we pivoted from our more traditional focus on SMT-related tech to talking about semiconductors and advanced packaging. Koh Young’s semiconductor business provides inspection and metrology systems for advanced packaging, including micro-solder deposits, high-density substrates, and wafer-level packaging, addressing the demanding requirements as components shrink and interconnect complexity grows.

United Electronics Corporation Installs Two New Automated Developing Lines

11/09/2026 | United Electronics Corporation
United Electronics Corporation (UEC), a domestic manufacturer of printed circuit boards, today announced the installation of two new conveyorized developing lines at its Franklin Park facility, both manufactured by Circuit-Tech Machinery.

Sundell Technology Laying the Groundwork for a ‘Certain’ Future

11/04/2026 | Tulip Gu, ECIO and Marcy LaRont, I-Connect007
In early September, Edy Yu and Tulip Gu of ECIO, and I-Connect007’s Marcy LaRont visited Sundell Technology’s Thailand facility at the Rojana Industrial Park in Ayutthaya Province. Two years into operation, the factory has devoted considerable investment and effort to things that are largely “invisible.” Registered in February 2023 and commencing production in 2024, the company has invested nearly RMB 1.2 billion in the facility, which covers approximately 267,000 square meters and was initially planned for a monthly production capacity of 120,000 square meters.

3 Key Takeaways: Understanding the Promise and Practical Limits of ELIC

10/26/2026 | I-Connect007
As semiconductor packages become smaller and more complex, PCB designers face increasing pressure to accommodate higher interconnect densities within tighter space constraints. Every layer interconnect (ELIC) technology offers a way to overcome some of the limitations of traditional HDI construction, but achieving greater density introduces new challenges in fabrication, reliability, and cost. In his white paper, ELIC: Every Layer Interconnect—The Promise, the Pain, and the Practical Limits, ASC President and CEO Anaya Vardya examines the advantages of ELIC architecture, the manufacturing challenges that accompany it, and the design decisions that determine whether a board can be produced reliably at scale.
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