Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

S-Transistors Raises €2.6M to Advance Scalable Quantum Computing Platform

08/31/2026 | VTT
Newly launched Finnish startup S-Transistors, originating from VTT Technical Research Centre of Finland, has raised €2.6 million in pre-seed funding to pioneer a fundamentally new class of integrated circuits based on superconducting transistors.

Micron Announces Leadership Appointments to Accelerate Innovation and Growth

08/28/2026 | Micron
Micron Technology, Inc. announced the promotion of two senior executives to newly expanded leadership roles designed to further strengthen the company's execution, innovation and long-term growth strategy.

NASA Awards Infleqtion $20M as World's First Quantum Gravity Mission Advances Toward Flight

08/27/2026 | BUSINESS WIRE
Infleqtion, a global leader in quantum computing and quantum sensing powered by neutral-atom technology, announced NASA has awarded the company a $20 million follow-on contract to continue development of the Quantum Gravity Gradiometer Pathfinder (QGGPf), a mission led by NASA’s Jet Propulsion Laboratory (JPL) that is designed to fly the world's first space-based quantum gravity sensor.

IBM Completes Acquisition of HRL Laboratories to Accelerate the Future of Quantum

08/26/2026 | IBM
IBM announced it has completed its acquisition of HRL Laboratories, LLC (HRL), a leading research and development institution whose expertise spans quantum computing, quantum sensing, advanced communications, electronics, manufacturing, and materials science.

Indium to Present Materials Solutions for the Next Wave of Power Electronics at CIPA 2026

08/26/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Leo Hu will examine the keys to precisely matching the diverse process requirements of power module packaging and assembly at CIPA 2026, August 31-September 2, in Wuxi, China.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in