It’s Only Common Sense: Hire for Hunger, Train for Skill
Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
NVIDIA Provides U.S. Postal Service AI Technology to Improve Delivery Service
November 6, 2019 | NVIDIA NewsroomEstimated reading time: 1 minute
NVIDIA has announced that the United States Postal Service—the world’s largest postal service, with 485 million mail pieces processed and delivered daily—is adopting end-to-end AI technology from NVIDIA to improve its package data processing efficiency.
The new system starts with high-performance servers powered by NVIDIA V100 Tensor Core GPUs and deep learning software to train multiple AI algorithms. The trained models are then deployed to NVIDIA EGX edge computing systems at close to 200 Postal Service facilities throughout the U.S. to enable more efficient package data processing. The NVIDIA-powered systems are being purchased by the Postal Service under contract with Hewlett Packard Enterprise.
“AI is transforming multiple industries, enabling processes, accuracy and efficiency not possible before,” said Anthony Robbins, vice president of the Federal Sector Business at NVIDIA. “The U.S. Postal Service’s adoption of AI demonstrates how this powerful technology can improve an excellent service that we rely on every day. Benjamin Franklin would be proud.”
The Postal Service operates the world’s highest volume logistics operation, processing and delivering some 146 billion pieces of mail annually, including more than 6 billion packages. The new AI system will process package data 10x faster and with higher accuracy.
Engineering teams from the Postal Service and NVIDIA have been collaborating for several months to develop AI models, using NVIDIA software including TensorRT™ for high-throughput, low-latency inference optimization; automatic mixed precision in PyTorch to accelerate training while maintaining model accuracy; NGC containers, which are GPU-optimized for streamlining software deployment; and DeepOps tools for optimizing GPU clusters.
Delivery and testing of the system will start this year and it is expected to be fully operational by spring of 2020.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Cadence, NVIDIA Expand AI & Accelerated Computing Partnership
04/17/2026 | Cadence Design Systems, Inc.At CadenceLIVE Silicon Valley 2026, Cadence announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins to unlock new levels of productivity and accelerate next‑generation engineering design flows across semiconductor design, physical AI systems and hyperscale AI factories.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMIElectronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
RTX's Raytheon Completes First Flight Test for RAIVEN® Sensing System
04/15/2026 | RTXRaytheon, an RTX business, has successfully completed the first flight test of its RAIVEN® Staring system, an air-cooled sensor suite that delivers greater situational awareness and operator survivability, on a UH-60 Black Hawk helicopter.