The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
NVIDIA Provides U.S. Postal Service AI Technology to Improve Delivery Service
November 6, 2019 | NVIDIA NewsroomEstimated reading time: 1 minute
NVIDIA has announced that the United States Postal Service—the world’s largest postal service, with 485 million mail pieces processed and delivered daily—is adopting end-to-end AI technology from NVIDIA to improve its package data processing efficiency.
The new system starts with high-performance servers powered by NVIDIA V100 Tensor Core GPUs and deep learning software to train multiple AI algorithms. The trained models are then deployed to NVIDIA EGX edge computing systems at close to 200 Postal Service facilities throughout the U.S. to enable more efficient package data processing. The NVIDIA-powered systems are being purchased by the Postal Service under contract with Hewlett Packard Enterprise.
“AI is transforming multiple industries, enabling processes, accuracy and efficiency not possible before,” said Anthony Robbins, vice president of the Federal Sector Business at NVIDIA. “The U.S. Postal Service’s adoption of AI demonstrates how this powerful technology can improve an excellent service that we rely on every day. Benjamin Franklin would be proud.”
The Postal Service operates the world’s highest volume logistics operation, processing and delivering some 146 billion pieces of mail annually, including more than 6 billion packages. The new AI system will process package data 10x faster and with higher accuracy.
Engineering teams from the Postal Service and NVIDIA have been collaborating for several months to develop AI models, using NVIDIA software including TensorRT™ for high-throughput, low-latency inference optimization; automatic mixed precision in PyTorch to accelerate training while maintaining model accuracy; NGC containers, which are GPU-optimized for streamlining software deployment; and DeepOps tools for optimizing GPU clusters.
Delivery and testing of the system will start this year and it is expected to be fully operational by spring of 2020.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
AV Switchblade 600 Loitering Munition System Achieves Pivotal Milestone with First-Ever Air Launch from MQ-9A
09/12/2025 | BUSINESS WIREAeroVironment, Inc. (AV) a global leader in intelligent, multi-domain autonomous systems, announced its Switchblade 600 loitering munition system (LMS) has achieved a significant milestone with its first-ever air launch from an MQ-9A Reaper Unmanned Aircraft System (UAS).
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
09/09/2025 | Josh Casper -- Column: Smart AutomationLarge, irregular, or mechanically unique parts, often referred to as odd-form components, have never truly disappeared from electronics manufacturing. While many in the industry have been pursuing miniaturization, faster placement speeds, and higher-density PCBs, certain market sectors are moving in the opposite direction.