The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
BAE Systems to Innovate Electronic Warfare Jamming Technology for U.S. Army
November 12, 2019 | BAE SystemsEstimated reading time: 1 minute
BAE Systems was awarded research and development funding through the U.S. Army to create an advanced radar jamming technology. The technology aims to improve air survivability and mission effectiveness for U.S. Army rotary-wing aircraft and unmanned aerial systems (UAS) by detecting and defeating complex and unknown threats in electronic combat.
As part of the contract, BAE Systems FAST Labs™ research and development team will design technology to integrate adaptive radio frequency jamming and sensing capabilities into one system. Whereas today's electronic countermeasure systems are too bulky and heavy for most rotary-wing and UAS platforms, BAE Systems technology will combine multiple, software-programmable antennas into a digital phased array that will enable simultaneous functions, exceeding existing capabilities while reducing the size, weight, and power (SWaP) of current systems. The technology will enable these platforms to safely fly closer to threats and within contested areas while remaining protected.
"With the continuously evolving threat landscape, it's critical to provide the next-generation of digital phased array technology to better defend our armed forces in electronic warfare," said Chris Rappa, product line director for Radio Frequency, Electronic Warfare, and Advanced Electronics at BAE Systems FAST Labs. "Our technology will give the Army's rotary-wing aircraft and UAS a new, low SWaP system to securely and drastically increase their range of movements in future missions."
Research for this contract adds to BAE Systems' advanced electronics portfolio and is based on many years of investment on various programs with the Air Force Research Lab (AFRL), U.S. Army, and the Defense Advanced Research Projects Agency (DARPA), including DARPA's CONverged Collaborative Elements for RF Task Operations (CONCERTO) and DARPA's Radio Frequency Field Programmable Gate Arrays (RF-FPGA) programs. Work for the contract will be completed at the company's facilities in Nashua, New Hampshire and Merrimack, New Hampshire.
About FAST Labs™ R&D
The FAST Labs™ R&D group of BAE Systems pushes the limits of what is possible; to create advanced technologies that give our customers the edge they need to win and our employees the chance to change the world.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.