Altair Acquires newFASANT, Further Expanding High-Frequency Electromagnetics Portfolio
January 6, 2020 | GlobeNewswireEstimated reading time: 1 minute

Altair, a global technology company providing solutions in product development, high-performance computing and data analytics, today announced the acquisition of newFASANT, offering leading technology in computational and high-frequency electromagnetics. newFASANT’s solutions address a wide range of electromagnetic problems in areas such as antenna design and placement, radar cross section (RCS) analysis, automotive V2V/ADAS, and infrared/thermal signatures.
Originally a spin-off from the University of Alcalá, near Madrid, newFASANT is home to world renowned industry pioneers. Its software portfolio containing various full-wave and high frequency asymptotic electromagnetic solvers, when combined with Altair Feko™, will allow Altair to leapfrog its competition and offer advanced solutions in relevant technology areas like V2V, Doppler effects, radome analysis, periodic structures, reflectarrays and others.
“We are thrilled to welcome newFASANT and its brilliant engineers to Altair,” said James Scapa, Altair’s chief executive officer and founder. “By combining its people and software into our advanced solutions offerings, we are clearly emerging as the dominant player in high-frequency electromagnetics – technology that is critical for solving some of the world’s toughest engineering problems.”
“We couldn’t be more excited to join the ranks of such a globally relevant and growing software player,” said Felipe Cátedra, chief executive officer of newFASANT. “Ever since we spun off from the University of Alcalá, we have grown the sophistication of our offerings, but by joining a powerhouse like Altair, we will be able to commercially expand our footprint immensely.”
This move solidifies Altair’s place as a world leader in high-frequency electromagnetics, a critical technology that supports advanced digital communications for areas such as IoT, cellular networks, mobile phones and connected devices, V2V, radar and radio.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.