Microchip Announces Industry’s First Space-Qualified COTS-Based Radiation-Tolerant Ethernet Transceiver and Embedded Microcontroller
January 15, 2020 | MicrochipEstimated reading time: 3 minutes

Ethernet is becoming more common in spacecraft to enable hardwired communication speed, support higher data rates, and facilitate interoperability between satellites and other spacecraft. As Ethernet in space applications continues to expand, Microchip Technology Inc. (Nasdaq: MCHP) today announced the industry’s first space-qualified Ethernet transceiver—a radiation-tolerant device based on a Commercial Off-the-Shelf (COTS) solution widely deployed in other industries now offering reliable performance for applications ranging from launch vehicles to satellite constellations and space stations.
In addition to Microchip’s new VSC8541RT radiation-tolerant Ethernet transceiver sampling, the company received final qualification for the new SAM3X8ERT radiation-tolerant microcontroller, its latest Arm® Cortex®-M3 core processor and embedded Ethernet controller. These are designed to support space industry demand for radiation tolerant devices separately or in combination.
Both devices are COTS-based parts with enhanced characterized levels of radiation performance and high reliability quality flow, available in plastic and ceramic packages. They share the same pin-out distribution, allowing designers to begin implementation with COTS devices before moving to space-grade components. This significantly reduces development time and cost.
“As the first to provide both a rad-tolerant transceiver and an enhanced rad-tolerant microcontroller for the rapidly-expanding, high-reliability Ethernet market, Microchip continues to support space industry developments and evolution with qualified and proven solutions,” said Bob Vampola, associate vice president of Microchip’s aerospace and defense group. “Microchip’s COTS-based space-grade processing provides the right performance and the right level of qualification to meet evolving requirements from Low-Earth Orbit constellations to deep space missions.”
These latest devices are among Microchip’s broad suite of COTS-based radiation tolerant microelectronics supporting Ethernet connectivity to be used aboard satellite platforms, payloads for data and sensor bus control, remote terminal communication, space vehicle networks, and module connectivity in space stations.
The VSC8541RT transceiver is a single-port Gigabit Ethernet copper PHY with GMII, RGMII, MII and RMII interfaces. Radiation performances have been verified and documented in detailed reporting. The VSC8541RT is latch-up immune up to 78 Mev; TID has been tested up to 100 Krad. With the same rad-tolerant die and package, a 100 MB limited bitrate performance VSC8540RT is also available in plastic and ceramic qualified versions, which provides performance and cost scalability for targeted missions.
The SAM3X8ERT radiation-tolerant MCU implements on a System on Chip (SoC) with the widely-deployed Arm® Cortex®-M3 core processor, delivering 100 DMIPS benefits from the same ecosystem as the industrial variant. The SAM3X8ERT contributes to the system integration trend helping to drive the space industry toward more advanced technologies. This microcontroller embeds up to 512 Kbytes Dual Bank Flash, 100 Kbytes SRAM, ADC & DAC and dual CAN controller on top of Ethernet capability.
These latest devices complement Microchip’s suite of radiation-tolerant and radiation-hardened hardware processing solutions. With the SAMV71Q21RT Arm® M7 MCU up 600DMIPS and ATmegaS128/64M1 8-bit MCU series, all share the same development tools.
Development Tools
To support the design process and accelerate time to market, developers can use the Arduino Due commercial kit for the SAM3X8ERT along with the VSC8541EV evaluation boards for the VSC8541RT. The SAM3X8ERT device is supported by Atmel Studio Integrated Development Environment for developing, debugging and software libraries.
Availability
The VSC8541RT in plastic or ceramic package is sampling today, and the SAM3X8ERT qualified devices are available today in production quantities. The SAM3X8ERT comes in ceramic prototype to space grade ceramic and high reliability plastic packages. The VSC8541RT comes in ceramic prototype to space grade ceramic and high reliability plastic packages. These range from QFP144 packages for SAM3X8ERT to CQFP68 packages for VSC854xRT. Complete product information is at www.microchip.com.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.
How Good Design Enables Sustainable PCBs
08/21/2025 | Gerry Partida, Summit InterconnectSustainability has become a key focus for PCB companies seeking to reduce waste, conserve energy, and optimize resources. While many discussions on sustainability center around materials or energy-efficient processes, PCB design is an often overlooked factor that lies at the heart of manufacturing. Good design practices, especially those based on established IPC standards, play a central role in enabling sustainable PCB production. By ensuring designs are manufacturable and reliable, engineers can significantly reduce the environmental impact of their products.