GaN Systems Captures a Place in the 2020 Global Cleantech 100
January 16, 2020 | GaN SystemsEstimated reading time: 1 minute

GaN Systems, the global leader in GaN (gallium nitride) power semiconductors, today announced that it has been named a 2020 Global Cleantech 100 company by Cleantech Group.
The 2020 Global Cleantech 100 is the 11th edition of the respected annual guide to the leading companies and themes in sustainable innovation. It features the private, independent and for-profit companies best positioned to contribute to a more digitized, de-carbonized and resource-efficient industrial future.
“We are honored to be named in the 2020 Global Cleantech 100,” says GaN System CEO Jim Witham. “It is yet another validation of our current position as the leader in GaN power semiconductors and as a company that continues to transform innovative energy-efficient solutions.”
The list combines Cleantech Group’s research data with qualitative judgements from nominations and insight from a global 80-member expert panel of leading investors and executives from corporations and industrials active in technology and innovation scouting. From pioneers and veterans to new entrants, the expert panel broadly represents the global cleantech community and results in a list with a powerful base of respect and support from many important players within the cleantech innovation ecosystem. The Global Cleantech 100 program is sponsored by Chubb.
“It feels right that our first list of the future-defining 2020s, should see a continued strengthening in the representation of truly impactful and necessary innovations to transform our diets, to enable a more renewable-heavy energy system, and to capture and utilize the vast levels of CO2 we have been freely emitting for decades,” said Richard Youngman, CEO, Cleantech Group. “Also included in our 2020 list are some big and critical shots at solving global problems—from proving out fusion and next-gen batteries to zero carbon aviation.”
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
IBM, RIKEN Unveil First IBM Quantum System Two Outside of the U.S.
06/24/2025 | IBMIBM and RIKEN, a national research laboratory in Japan, today unveiled the first IBM Quantum System Two ever to be deployed outside of the United States and beyond an IBM Quantum Data Center.
Excellon Installs COBRA Hybrid Laser at Innovative Circuits
06/23/2025 | ExcellonExcellon is pleased to announce the successful installation of a second COBRA Hybrid Laser System at Innovative Circuits, located in Alpharetta, Georgia. The Excellon COBRA Hybrid Laser System uniquely combines both UV and CO₂ (IR) laser sources on a single platform—making it ideal for high-density prototype and production printed circuit boards (PCBs).