TiaLinx Delivers Programmable Polarized Antenna for Wafer Scale Integration Module
January 21, 2020 | TiaLinx, Inc.Estimated reading time: 1 minute

TiaLinx, Inc., the developer of the highly integrated wireless systems announced successful implementation of its programmable polarized antenna technology at the X- and Ka-bands.
The core technology is being augmented to address a fully integrated programmable polarized cell with beamsteering capability in an antenna array ("P2BA2™"). P2BA2 is a micro module and ideal technology to significantly enhance the coverage and quality of 5G wireless links. P2BA2 can be expanded to 32 x 32 arrays as an element of massive tiles for ground terminal connectivity with communication satellites. The development of the P2BA2 cell has been sponsored by a SBIR Phase II grant from the Air Force Research Laboratory.
TiaLinx's patented wafer-scale beamforming technology and its planar antenna arrays enable scanning with fine lateral resolution, ultimately enhancing the connectivity of the users to 5G cell clusters.
Furthermore, signal processing with polarization capabilities enhances the suppression of scattering in a cluttered environment, while the advanced ultra-wideband (UWB) transmitter and receiver provide the user with the ability to obtain ultra-fast multi-band access to download movies in seconds.
According to Statista's market projections, the worldwide adoption of 5G smartphone subscription will reach to 2.8 billion by the year 2024.
About TiaLinx, Inc.
TiaLinx, Inc. is a privately held company with 100% American ownership. The Company develops advanced electronic micro modules with highly integrated functionality and advanced performance for a wide range of mobile wireless connectivity for consumer, automotive, industrial and medical applications. Utilizing tens of its granted and many more pending patent applications, the Company is uniquely positioned to provide small footprint, portable, and low-cost wireless modules.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.