VPX Open Frame Development Chassis from LCR Offer Unmatched Configuration Flexibility for Fast Development Cycles
January 22, 2020 | LCR Embedded SystemsEstimated reading time: 1 minute

LCR Embedded Systems has released two new VPX Development and Evaluation Chassis for 3U and 6U systems. The DK3 and DK6 feature enhanced flexibility, fast conversion between air and conduction cooled module support, as well as fast backplane replacement. The chassis’ modular design enables easy reconfiguration through every stage of development leading up to the deployable chassis.
Part of our family of development chassis, the DK3 and DK6 open frame benchtop designs include backplane, power supply, push/pull fan cooling and rear transition slots in support of a variety of test functions. These chassis are ideal for single VPX module development or full system level integration and testing.
Two base versions are available for development of either 3U or 6U modules. Standard configurations may include power and ground backplanes, or application specific VPX or SOSA-aligned versions with up to 12 slots, depending on pitch requirements. Combinations of air and conduction cooled card guides and power supplies to support a range of module types and power requirements are also available. All LCR development systems can be configured with VPX, VME, cPCI or cPCI Serial backplanes.
“VPX is becoming the go-to COTS open standard architecture for developing new high-speed systems in defense applications. Designing, testing and integrating a VPX system is complex and time consuming under the best circumstances. A good development platform should ease the burden. The DK3 and DK6 offer the flexibility and overall ease-of-use demanded by our customers as we support them from program development to full-scale deployment,” said LCR Embedded President Dan Manoukian.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
IBM, RIKEN Unveil First IBM Quantum System Two Outside of the U.S.
06/24/2025 | IBMIBM and RIKEN, a national research laboratory in Japan, today unveiled the first IBM Quantum System Two ever to be deployed outside of the United States and beyond an IBM Quantum Data Center.
Excellon Installs COBRA Hybrid Laser at Innovative Circuits
06/23/2025 | ExcellonExcellon is pleased to announce the successful installation of a second COBRA Hybrid Laser System at Innovative Circuits, located in Alpharetta, Georgia. The Excellon COBRA Hybrid Laser System uniquely combines both UV and CO₂ (IR) laser sources on a single platform—making it ideal for high-density prototype and production printed circuit boards (PCBs).