Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
It’s Only Common Sense: Selling During an Economic Downturn
Marcy’s Musings: Can You Hear the Voices?
StratEdge Features Semiconductor Packages and Assembly Services at Three Trade Shows in March
February 25, 2020 | StratEdgeEstimated reading time: 1 minute
StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, will have applications specialists available at the IMAPS Device Packaging Conference, APEC 2020, and GOMACTech 2020 to discuss the many packages available for DC to 63+ GHz and its package assembly services.
Packages include:
- Post-fired ceramic, low-cost molded ceramic, and ceramic QFN packages
- The LL family of leaded laminate copper-moly-copper (CMC) base packages
- High-power semiconductor packages
- Off-the-shelf molded ceramic packages that can be configured to meet the requirements for chips with frequencies up to 18 GHz. These packages provide enhanced thermal dissipation for high-power gallium nitride devices and come in fully hermetic versions in over 200 standard outlines.
- High-reliability packages that meet stringent military applications. The packages have electrical transition designs that ensure exceptionally low electrical losses and operate efficiently, even at the highest frequencies.
"Much attention is given to GaN chips, but the package in which the GaN device is attached and the way the chip is attached to the package is often overlooked," explained Casey Krawiec, VP of global sales for StratEdge Corporation. "It's well known that GaN chip efficiency and reliability can be improved by creating a package environment that reduces chip-to-package junction temperatures. StratEdge has developed a proprietary eutectic die attach method that drops junction temperatures by 20 degrees when compared to standard assembly methods with ceramic packages. Please stop by our booths and find out more."
StratEdge will be at IMAPS Device Packaging Conference, Fountain Hills, AZ, from March 3-4 in booth 56, APEC 2020, New Orleans, LA, from March 16-18 in booth 2157, and at GOMACTech 2020, San Diego, CA, from March 17-18, in booth 202.
Share on:
Suggested Items
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.
Real Time with... IPC APEX EXPO 2025: Tariffs and Supply Chains in U.S. Electronics Manufacturing
04/01/2025 | Real Time with...IPC APEX EXPOChris Mitchell, VP of Global Government Relations for IPC, discusses IPC's concerns about tariffs on copper and their impact on U.S. electronics manufacturing. He emphasizes the complexity of supply chains and the need for policymakers to understand their effects.