Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Dan’s Biz Bookshelf: ‘Believe in Better'
1mm-Thin Polymer Aluminum Electrolytics Provides High Ripple Current and Capacitance
March 9, 2020 | Cornell Dubilier Electronics, Inc.Estimated reading time: 1 minute
The new PPC Series of ultra-thin polymer aluminum electrolytic capacitors from Cornell Dubilier represents a totally new capacitor form factor. Designed specifically for applications requiring high ripple current and the thinnest possible profiles, type PPC opens up new product design options. In addition to being just 1 mm thin, the PPC uses versatile packaging technology that makes it possible for capacitors to be formed into custom shapes and sizes to accommodate available space.
“A single PPC capacitor offers capacitance and ripple current equivalent to dozens of SMT capacitors or a bulky cylindrical device,” said Mario DiPietro, Product Manager at Cornell Dubilier. As an example, the company claims that a single PPC capacitor is equivalent to a parallel bank of 50 or more polymer tantalum capacitors and occupies one fourth the height. Also, circuit reliability is improved by using a single component versus an entire array of SMT capacitors.
Custom values are available within a capacitance range of 8,000 µF to 20,000 µF, with working voltages ranging from 6.3 to 24 WVDC. The company plans to extend the series to higher operating voltages later in the year. Operating life is 2,000 hours @ 125° C.
The PPC is rated for 10 g peak for vibration and withstands shocks up to 100 g’s (MIL-STD-202, Method 213, Condition I). With flat tin-plated copper terminations, it is possible to mount the device off-board or directly to a PCB. Mounting is by means of 3M double-sided VHB tapeTM, to ensure that the entire capacitor surface is kept rigid.
Developed by Cornell Dubilier, the PPC is the latest leading-edge capacitor development by the company. These designs have been responsive to market demands for capacitors that provide higher performance while breaking away from traditional cylindrical form factors.
Share on:
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.