Military Exercise Highlights Multi-Function Capabilities and Operational Readiness of Semiconductor Technology
March 16, 2020 | BAE SystemsEstimated reading time: 1 minute

In a recent military exercise attended by representatives from multiple research labs and military service branches, BAE Systems successfully demonstrated new, powerful small-form-factor semiconductor technology. The Hedgehog technology, which was used in this exercise to sense radio frequency (RF) and communication signals in congested and contested battle environments in conjunction with an unmanned aerial system, is a collection of general-purpose, reconfigurable MATRICs™ chips in a software-defined radio (SDR) system.
The Hedgehog demonstration was in support of the Defense Advanced Research Projects Agency (DARPA) Distributed RF Analysis and Geolocation on Networked System (DRAGONS) research. The DRAGONS program is designed to deliver a drone-integrated, small form factor signal identification and geolocation capability. This research and the underlying research on MATRICs and Hedgehog was developed with funding from DARPA.
"Our successful demonstration underscores the capabilities of our breakthrough Hedgehog technology moving one step closer toward operational readiness," said Chris Rappa, product line director for Radio Frequency, Electronic Warfare, and Advanced Electronics at BAE Systems FAST Labs. "The importance of this potentially game-changing technology is that it can be deployed for many different purposes across a multitude of platforms and mission types, providing deployed units with a tactical advantage only previously possible with large scale platform support."
The demonstration highlighted the ability for forward operators to deploy technology to secure tactical signals intelligence and geolocation data in near real-time with low size, weight and power requirements. The technology provides agility, a broad frequency range, and high instantaneous bandwidth – all key capabilities that are not currently available from other SDRs.
Hedgehog is backed by BAE Systems' MATRICs chips, which are less expensive and time consuming to develop than traditional application-specific chips and can be integrated into a variety of systems to help address future requirements of electronic warfare, communications, and signal intelligence systems. Development of Hedgehog and MATRICs chips technology is part of the BAE Systems advanced electronics portfolio, which comprises research and development in advanced materials, microelectronics, and integrated circuits.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.