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Advanced Electronics Packaging Digest

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NVIDIA, Supply Chain Partners Expand Capacity to Accelerate AI Infrastructure Buildout

10/21/2026 | Globe Newswire
NVIDIA announced plans with a group of supply chain partners to expand global manufacturing capacity to meet growing demand for its accelerated computing and full-stack AI factory platform.

Kratos Breaks Ground on New AN/SPY-1 Radar and Helios Hypersonics Testing Facilities in Indiana

10/15/2026 | Globe Newswire
Kratos Defense & Security Solutions, Inc., a technology company in defense, national security, and global markets, today celebrated a joint groundbreaking ceremony, at the Westgate Academy in Odon, Indiana, marking the beginning of construction for its new Helios and AN/SPY-1 facilities.

CPO Optical-Electrical Testing Drives Test Equipment Supply Chain Shift

10/13/2026 | TrendForce
TrendForce’s latest research on AI interconnect technologies reveals that growing demand for high-speed transmission in AI data centers is accelerating the transition of co-packaged optics (CPO) toward mass production, making shorter test times and lower costs increasingly important.

From Legacy to Next-Generation PCBAs: Zero-Defect Testing in Aerospace and Defense Electronics

10/13/2026 | Francesca Pinto, SPEA
In the aerospace and defense industry, a PCB assembly is never just a collection of components soldered onto a substrate. It is a working part of a much larger mission system responsible for flight control, navigation, communication, power distribution, surveillance, or targeting. Whether it sits inside a civil aircraft, an autonomous drone, a compact satellite, an advanced radar unit, or a military ground vehicle, that assembly is expected to perform without fail throughout its service life, often measured in decades.

Trio-Tech Secures $4.45M Burn-In Equipment Contract

10/08/2026 | BUSINESS WIRE
Trio-Tech International, a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced it has secured a new three-year contract valued at approximately $4.45 million to provide burn-in testing equipment and ongoing technical and maintenance support to an existing European automotive semiconductor customer.
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