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New Episode Drop: MKS’ ESI’s Role in Optimize the Interconnect

08/21/2025 | I-Connect007
In this latest episode, Casey Kruger, director of product marketing at MKS’ ESI, joins On the Line With… host Nolan Johnson to share how CO₂ laser technology delivers faster, more accurate vias in a smaller, more energy-efficient footprint.

PEDC Call for Abstracts Deadline Extended to Aug. 31

08/20/2025 | I-Connect007 Editorial Team
The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.

Meet the Round 1 Winners of the Bright Manufacturing Student Challenge 2025

08/20/2025 | Tara Dunn, SMTA
The Bright Manufacturing Student Challenge is an opportunity for student teams to design and develop innovative solutions for real-world electronics manufacturing problems. The eight-week competition, sponsored by the Electronics Manufacturing & Assembly Collaborative (EMAC) through electronicsworkforce.com, allows students to showcase their technical skills, creativity, and problem-solving abilities.

University Of Minnesota Team Claims Victory In Bright Manufacturing Challenge 2025 Round 1

08/19/2025 | EMAC
The Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced that Team "Rise and Grind Crew" from the University of Minnesota has emerged victorious in Round 1 of the Bright Manufacturing Challenge 2025.

Happy’s Tech Talk #42: Applying Density Equations to UHDI Design

08/19/2025 | Happy Holden -- Column: Happy’s Tech Talk
With the need for faster speeds, more parts on an assembly, and the trend to make things smaller for portability, the printed circuit design and layout process is both creative and challenging. The process involves “applying the density equation” while considering certain boundary conditions, such as electrical and thermal performance. Unfortunately, many designers don’t realize there is a mathematical process to laying out a printed circuit.
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