Machine Vision: MVTec Presents New and Optimized Features With Halcon 20.05
April 8, 2020 | MVTecEstimated reading time: 2 minutes
MVTec Software GmbH, the leading international provider of machine vision software, will launch a new Progress release of its standard software HALCON on May 20, 2020. HALCON 20.05 offers both entirely new features and updated technologies from the previous version, which can be used to further optimize machine vision processes. The bar code reader has been improved by an advanced decoding algorithm, which increases the decoding rate when reading codes with very thin bars. Thanks to this, it is now possible to even read codes with bars smaller than one pixel. With HALCON 20.05, training for all deep learning technologies can now be performed on a central processing unit (CPU). By removing the need for a dedicated graphics processing unit (GPU), standard industrial PCs that could not house powerful GPUs can now be used for training. Customers benefit from significantly greater flexibility regarding the implementation of deep learning, because training can now be performed directly on the production line.
Another new development is that the generic box finder released with the previous version has been improved in terms of robustness, performance, speed, and usability: With MVTec HALCON 20.05, it is now much easier to find boxes of different shapes and sizes reliably. In addition, the Grad-CAM-based heatmap (Gradient-weighted Class Activation Mapping) can now be calculated on the CPU without significant speed drops. This means that users are now able to analyze directly which parts of an image influence the deep learning network's classification decision. Moreover, the anomaly detection has been significantly improved in the current HALCON version. Training the network is now up to ten times faster, and inference speed has also been improved. Trained networks now also require less memory and disk space, which makes the feature more viable for use on embedded devices.
Surface-based 3D matching improved
Another new function improves processes in manufacturing, where workpieces must be located robustly and accurately to allow for further processing. Characteristics such as small holes are often the only unique features to find the correct orientation of the object. HALCON's surface-based 3D matching can now make use of such features to improve the accuracy and robustness of the matching results.
"More than ever before, MVTec HALCON 20.05 demonstrates the benefits that the short release cycle of our HALCON Progress Edition has to offer. In addition to the fast delivery of new features, we can also incorporate the latest customer feedback into the software product within a short period of time. This approach allows us to quickly optimize functionalities and thus make them even more attractive to our customers," explains Mario Bohnacker, Technical Product Manager HALCON at MVTec.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Magnachip Semiconductor Announces YJ Kim to Step Down as CEO; Current Board Chairman Camillo Martino Appointed Interim CEO
08/14/2025 | PR NewswireMagnachip Semiconductor Corporation today announced that YJ Kim has agreed to step down as CEO and as a member of the Board of Directors, effective immediately. Camillo Martino, Chairman of the Board of Directors, has also been appointed Interim Chief Executive Officer, effective immediately.
Bell to Build X-Plane for Phase 2 of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
07/09/2025 | Bell Textron Inc.Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 2 of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program with the objective to complete design, construction, ground testing and certification of an X-plane demonstrator.
Nolan’s Notes: Moving Forward With Confidence
06/03/2025 | Nolan Johnson -- Column: Nolan's NotesWe’re currently enjoying a revitalized and dynamic EMS provider market with significant growth potential. Since December 2024, the book-to-bill has been extremely strong and growing. Starting with a ratio of 1.24 in December, book-to-bill has continued to accelerate to a 1.41 in April. Yet, there is a global economic restructuring taking place. To say that the back-and-forth with tariffs and trade deals makes for an uncertain market is an understatement. While we may be in a 90-day tariff pause among leading economic nations, the deadline is quickly approaching and that leaves many of you feeling unsettled about what to expect.
Mycronic High Flex Changes Division Name to PCB Assembly Solutions
05/20/2025 | MycronicMycronic AB, the leading Sweden-based electronics assembly solutions provider, announced that its division formerly known as High Flex will now operate under the name PCB Assembly Solutions.