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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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I-Connect007 Welcomes Newest Columnist, Tianming Liu, FS Quality

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I-Connect007 is excited to announce its newest columnist, Tianming Liu, founder of First Quality Circuit Co. Ltd. (FS Quality) and Fuji PCB. His new column, Bridging the Pacific, will draw on more than three decades of experience in PCB manufacturing to explore the different manufacturing cultures, practices, and perspectives found across the global electronics industry.

Indium to Present Materials Solutions for the Next Wave of Power Electronics at CIPA 2026

08/26/2026 | Indium Corporation
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HANZA Continues the Horizon Program and Closes Gateway China

07/14/2026 | HANZA
Earlier this year, HANZA launched its HANZA 2028 strategy, aimed at broadening the Group’s manufacturing capabilities through the introduction of new technologies while also expanding capacity and expertise within existing technologies.

Cellular IoT Module Revenues Grew 19% to $5.6B in 2025

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According to a new research report from the IoT analyst firm Berg Insight, annual shipments of cellular IoT modules amounted to 612 million units in 2025, up 33 percent from the previous year. Annual sales increased by 19 percent to US$ 5.6 billion in the year.
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