Pasternack Launches Seven New Fixed Load VNA Calibration Kits
June 1, 2020 | PasternackEstimated reading time: 1 minute

Pasternack, an Infinite Electronics brand and a leading provider of RF, microwave and millimeter wave products, has just released a new line of short-open-load-through (SOLT) calibration kits that are ideal for use in test and measurement, lab and RF & Microwave production test applications.
Pasternack’s expanded line of VNA calibration kits are available in 12 versions including short circuit, open circuit and load kits (SOL) as well as short circuit, open circuit, load and thru kits (SOLT) with 2.4mm, 2.92mm, 3.5mm, 7/16 DIN, 7mm, BNC and N-Type interface options.
Each of these new VNA calibration kits from Pasternack include all of the necessary short circuit, open circuit, loads and thru (model dependent) components required for VNA calibration. The kits are suitable for many vector network analyzers from the industry’s leading providers such as Agilent, Rohde & Schwarz, Anritsu and Copper Mountain. These RF test and measurement kits come packaged in protective wooden boxes.
The new SOLT calibration kits offer excellent performance characteristics that are specially designed for the fine-tuning and calibration of sensitive test equipment in engineering labs, production environments and quality testing facilities. Every Pasternack calibration kit is built to withstand years of rigorous use and provides accurate RF equipment calibration for the life of the product.
“A properly calibrated VNA is required for precise characterization of RF and microwave components used in a myriad of industries and applications. These new SOLT calibration kits provide the precision components that are essential to perform accurate analyzer calibrations,” said Steve Ellis, Interconnect Product Line Manager at Pasternack.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.