Ambarella Adopts Cadence Clarity 3D Solver for AI Vision Processor Development
June 1, 2020 | Business WireEstimated reading time: 1 minute

Cadence Design Systems, Inc. announced that Ambarella, Inc. has adopted the Cadence Clarity 3D Solver for design of their next-generation AI vision processors.
Ambarella’s products are used in a wide variety of human and computer vision applications, including video security, advanced driver assistance systems (ADAS), electronic mirror, drive recorder, driver/cabin monitoring, autonomous driving and robotic applications.
Per a recent evaluation, an Ambarella computer vision (CV) system on chip (SoC) and PCB were run on the Cadence Clarity 3D Solver. Results of both simulations show that when there is no solid reference plane for high-speed signals, the Clarity 3D Solver identifies the Ambarella design defects and correct scattering parameter (S-parameter) response. For both simulations, the Clarity 3D Solver, a 3D electromagnetic solver using 32 CPUs, took just 29 hours to process the case with 202 ports running at 48 bits via a LPDDR4 interface on a geometrical combination of package and PCB layout design.
“Ambarella continuously upgrades our system design methodologies to stay ahead of the competition,” said Chan Lee, vice president of VLSI at Ambarella, Inc. “The speed, capacity and accuracy of the Cadence Clarity 3D Solver enable us to accelerate our design process and shorten our schedule. We expect that many of the likely challenges of our next-generation 5nm AI design project can be easily and quickly addressed with the Cadence Clarity 3D Solver.”
The Clarity 3D Solver harnesses state-of-the-art distributed multiprocessing technology to efficiently tackle electromagnetic (EM) challenges encountered when designing complex 3D structures. The innovative Clarity 3D Solver is integrated with Cadence’s chip, package and PCB design solutions as part of Cadence’s Intelligent System Design™ strategy.
Suggested Items
Polar Brings New Book 'The PCB Designers Guide to... More Secrets of High Speed PCBs' to EIPC Edinburgh
05/27/2025 | Polar InstrumentsPolar's latest book, The PCB Designer's Guide to... More Secrets of High Speed PCBs, will see its European Launch at the EIPC conference in Edinburgh, June 3-4, 2025. More Secrets unveils more of the knowledge that is often missed from theoretical text books to help both new and experienced designers realize the PCBs they “thought” they had designed.
FastlinkPCB Accelerates Global Expansion, Builds Efficient PCB Industry Chain
05/26/2025 | FastlinkPCBFastlinkPCB, a PCB manufacturing and assembly solutions provider, announced that it has completed the layout of subsidiaries in the US, Germany, Switzerland, and Malaysia over the past year, forming a localized service network covering North America, Europe, and Southeast Asia.
Defining the Ideal PCB Design Data Output
05/27/2025 | Stephen V. Chavez, Siemens EDAAt the heart of delivering successful, manufacturable printed circuit boards lies a vital question: What should your design data output package include to best support manufacturing? The answer: It depends. There are many factors to consider regarding the specific category you’re designing for—such as mil/aero, space, medical, and commercial. Other factors that need to be considered are requirements and engineering intent.
Indium to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC
05/22/2025 | Indium CorporationIndium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component and Technology Conference (ECTC), taking place May 27-30 in Dallas, Texas.
HBM4 Raises the Bar on Manufacturing Complexity, Premium Expected to Exceed 30%
05/22/2025 | TrendForceTrendForce's latest findings reveal that demand for AI servers continues to accelerate the development of HBM technologies, with the three major suppliers actively advancing their HBM4 product roadmaps.