MFS Technology Opens Fourth Manufacturing Plant
June 8, 2020 | MFS TechnologyEstimated reading time: 1 minute
MFS Technology recently opened its fourth manufacturing plant. The new factory, which specializes in high-precision flexible printed circuit boards and electronics components assembly, is in Yiyang city’s Economic Development Zone, Hunan, China.
The first part of the two-phase development is fully completed and begins volume production in June 2020.
The new setup, which sits on 11 hectares of land, adds 300,000 sqm of capacity of MFS Technology each year.
It is equipped with the latest technology, ranging from roll-to-roll FPC (double-sided) process, class-1000 clean room and highly automated equipment. The new facility combines a high degree of machine integration with over three decades of experience accumulated in three existing factories— one in Malaysia and two in China.
A diversified pool of experienced technical and management expertise in Singapore, Malaysia and China across the organization has aided the factory’s quick and steady volume ramp-up.
Headquartered in Singapore, MFS Technology serves more than 200 multinational companies in a wide range of markets including Automotive, Industrial, Medical, Mobile, Consumer and Power Management.
“The state-of-the-art Yiyang factory adds strength to our worldwide sales to meet high volume requirement in addition to our proven capability to fulfil high mix and mid volume business,” the company mentions in a local news coverage of the new plant.
Suggested Items
Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC
05/16/2024 | Indium CorporationIndium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado.
Siemens, Foxconn Team Up to Optimize Forward-thinking Manufacturing
05/16/2024 | FoxconnSiemens AG, a leading technology company, and Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer, have signed a memorandum of understanding (MoU) to drive digital transformation and sustainability in smart manufacturing platforms.
TactoTek Licenses IMSE Technology to Polestar for Sustainable Electronics Design Innovation
05/15/2024 | TactoTekPolestar, the Swedish electric performance car brand, and Finnish smart surface pioneer TactoTek, have entered a collaboration to explore integration of Injection Molded Structural Electronics (IMSE) technology into Polestar’s vehicle programs.
SiPearl: Partnership with Samsung Electronics for built-in HBM in Rhea
05/14/2024 | BUSINESS WIRESiPearl, the company building the high-performance low-power European microprocessor for HPC and AI inference, has signed a partnership with Samsung Electronics Co. Ltd., a world leader in advanced memory technology, to equip its Rhea series with Samsung’s advanced memory solution ideal for HPC and AI applications.
ispace EUROPE, CDS Sign Payload Service Agreement to Transport Precise Location Measurement Technology to the Moon
05/14/2024 | BUSINESS WIREispace EUROPE S.A., the Luxembourg-based subsidiary of ispace, inc., and Control Data Systems SRL (CDS) have signed a payload services agreement to transport precise location measurement equipment to the Moon, the two companies announced.