Lockheed Martin Chooses Austin American Technology for Cleaning Needs
July 8, 2020 | Austin American Technology Corp.Estimated reading time: 1 minute
Austin American Technology announced their newest machine sale to Lockheed Martin, which purchased an X30-A Vertical Format Batch Cleaning System.
Lockheed Martin is one of the most renowned companies in the world. With 110,000 employees, billions in revenue, and 375+ locations across the globe, Lockheed Martin Corporation is an American aerospace, defense, arms, security, and advanced technologies company with worldwide interests. Whether it's protecting citizens or advancing the boundaries of science, their missions are some of the most important and challenging in the world.
This means they can only use the best of the best when it comes to their equipment, which lead them to purchase the X30-A stencil cleaner from AAT. “It is just the right decision for our Clearwater site,” commented Axel Vargas, Senior Manufacturing Engineer, Lockheed Martin. “We have two units that have been in uninterrupted service for over two decades. We typically prefer standardization of our production equipment. In this case, the performance, combined with the longevity these cleaners offer, is difficult to mimic. Top that with second-to-none US based customer support.”
Austin American Technology’s X30™ Vertical Format Batch Cleaning Systems provide maximum chemistry flexibility to meet a wide variety of applications. Aqueous, saponification, semi-aqueous, alcohols and hybrid solvents can be utilized to remove flux residues, solder pastes, inks, adhesives and other residues from boards, stencils, or tooling used in the production process. Each system incorporates filtration and a selectable open-loop or closed-loop configuration to address environmental and safety concerns.
Consistent cleaning results are ensured with a patented method of rotational spraying that creates zones of constantly changing force to provide superior performance. X30™ cleaning systems are fully automated and do not require product transference between wash, rinse and dry cycles. The cleaner’s automated, low-profile lift and compact body design facilitate easy load/unload and provide one of the smallest footprints in the industry. And, the X30™ is supported by the extensive experience and knowledge base of Austin American Technology’s applications engineering team.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.