Trouble in Your Tank: Can You Drill the Perfect Hole?
It’s Only Common Sense: Your Guide to Better Time Management
Dan's Biz Bookshelf: 'Move Your Bus'
8 Measures for Sales and Operations Planning in Turbulent Times, Part 4
August 4, 2020 | Fane Friberg, CEPHASEstimated reading time: 1 minute
In this series, CEPHAS principal Fane Friberg highlights the interdependent elements of an effective S&OP process for leaders of supply chain management. While some companies tend to fall back on the status quo, Freiberg highlights why it’s critical to actually increase the frequency of the S&OP rather than decrease the operations. He has reviewed the importance of staying committed, strategic imperatives, and participation. Today, he discusses technology.
Focus #4: Technology
What leading values will be the most reliable to let us know when it is “safe” to leave our homes and reopen countries? We are beginning to see “opened” areas now taking some steps backward as a potential second wave appears possible. It is unrealistic to presume that we will be able to effectively navigate this crisis by simply closing again.
Leadership must structure the process clearly to communicate the location, forum, tools, etc., that will be used during the S&OP meeting. Proactively have each member pre-use the technology so that the meeting starts and ends on time and is a productive collaboration.
Determine what technology must be used daily to keep all activities and processes within planning, coordination, operation, control, and optimization of the whole supply chain system running at maximum efficiencies. The daily dynamics most likely do not allow for sustained (all-day meetings); therefore, the leading indicators must have a prescriptive plan to drive systematic (cause and effect) supply chain management.
This information and technology plan must meet the operating requirements for fulfilling basic business profitability and market goals. The information and technology must also provide the overall desired framework in developing the master production schedule and in evaluating capacity and resource requirements.
Fane Friberg is principal of CEPHAS.
Share on:
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.