It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Alpha Insights, Performance by Design: The Future of PCB Manufacturing in the Midwest
Happy’s Tech Talk #43: Engineering Statistics Training With Free Software
CyberOptics Demonstrates Advanced Sensor Technology at SEMICON Taiwan
September 2, 2020 | CyberOptics CorporationEstimated reading time: 1 minute
CyberOptics® Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will exhibit at SEMICON Taiwan, September 25-26 in booth #L0310. During the show, the company will feature its new In-Line Particle Sensor™ (IPS) and Auto Resistance Sensor™ (ARS) for semiconductor tool set-up and equipment diagnostics, and the WX3000™ Metrology and Inspection system for wafer-level and advanced packaging applications.
An extension of the industry-leading WaferSense® and ReticleSense® Airborne Particle Sensor (APS) technology that is documented by fabs as the Best Known Method (BKM), the new In-Line Particle Sensor (IPS) with CyberSpectrum™ software detects particles in gas and vacuum lines 24/7 in semiconductor process equipment. The IPS quickly identifies monitors and enables troubleshooting of particles down to 0.1µm.
The new WaferSense® Auto Resistance Sensor™ (ARS) with CyberSpectrum™ software for semiconductor tool set-up and diagnostics enables real-time resistance measurements of plating cell contacts in semiconductor Electrochemical Deposition (ECD) applications.
Process and equipment engineers in semiconductor fabs can speed equipment qualification, shorten equipment maintenance cycles, lower equipment expenses and optimize preventative maintenance plans.
“Whether it’s used in the front-end, mid-end or back-end of the semiconductor fab, our high-precision sensor technology is delivering significant improvements in yields, processes, productivity and through-put,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics.
For wafer-level and advanced packaging metrology and inspection, the new WX3000™ system will be featured. Performing two to three times faster than alternate technologies at data processing speeds in excess of 75 million 3D data points per second, the NanoResolution Multi-Reflection Suppression™ (MRS™) sensor-enabled WX3000 systems deliver throughput greater than 25 wafers per hour. 100% 3D and 2D metrology and inspection can be completed simultaneously at high speed, as compared to an alternate, slow method that requires two separate scans for 3D and 2D and only a sampling of a few die.
The proprietary NanoResolution MRS sensor, deemed best in class, meticulously identifies and rejects multiple reflections caused by shiny and mirror-like surfaces. Effective suppression of multiple reflections is critical for highly accurate measurements.
For more information, visit www.cyberoptics.com.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
LPKF Joins productronica’s 50th Anniversary, Showcasing Laser Technology for Electronics Manufacturing
10/10/2025 | LPKF Laser & ElectronicsLPKF Laser & Electronics invites visitors to productronica 2025 in Munich from November 18 to 21. At booth 305 in hall B2, the company will present its portfolio of modern laser technologies for the electronics industry live – from prototyping systems and high-performance depaneling to laser plastic welding for electronic housings and thin glass processing for advanced packaging.
Marco Pieters Appointed ASML Chief Technology Officer
10/09/2025 | ASMLASML Holding NV (ASML) announced the appointment of Marco Pieters as Executive Vice President and Chief Technology Officer, reporting to President and Chief Executive Officer, Christophe Fouquet.
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
EDADOC Ushers in a New Era of Robotics Innovation
10/07/2025 | Edy Yu, Editor-in-Chief, ECIOOn Sept. 11, Shanghai Zhiyuan Technology Co., Ltd. (MScape) made a stunning debut at Shanghai’s 2025 Fourth North Bund Cybersecurity Forum and Cyber Intelligence Security Frontier Technology and Equipment Exhibition. The company presented the world’s first Dvorak super heterogeneous architecture and the Zhijing T-series-embodied intelligence (robotics) edge computing power platform. This has been a game-changer in the cybersecurity technology field, filling the gap in the domestic robotics core computing power platform.