ASM Opens Up New Possibilities in High-Volume Solder Paste Printing
September 24, 2020 | ASM Assembly SystemsEstimated reading time: 2 minutes
With an update, technology leader ASM presents additional functions for its high-volume DEK TQ printer, which sets new records in terms of speed, floor space performance and wet-printing accuracy. With its perfectly matched combination of print head, paste dispenser and innovative understencil cleaning system, the DEK TQ can operate for up to 8 hours without an operator assist. With its new hardware and software options, the printer features even more capabilities now. The innovations comprise its offline programming, the DEK TQ V1 operating software, the High Flow Vacuum board support system, and the intelligent and flexible verification and traceability functions.
With new options and software enhancements, technology leader ASM further improves the operability and capabilities of its DEK TQ stencil printer. The High Flow Vacuum function, for example, provides an affordable and highly efficient board support solution for the high-volume production of small and highly complex PCBs.
The new and highly flexible and intelligent verification function allows the verification of all printer materials either by means of the ASM OIB, with an interface to a higher-level MES (ideal for testing and releasing the solder paste) or individually selectable against a reference on the DEK TQ for supports, squeegees, etc.
Together with the sophisticated traceability functions, this provides an ideal connection of the DEK TQ to the Smart Factory.
New software
The DEK V1 station software and SIPLACE Pro have been revised from the ground up. With ASM Printer Programming and its integration into SIPLACE Pro, central program management is being raised to a new level. Printing programs are now administered across lines, printing and placement programs downloaded jointly to SMT lines, and each printer’s features are verified automatically before a program is executed.
DEK TQ – the standard for high-volume production
The DEK TQ sets new standards in performance, efficiency and precision. In a footprint of only 1.3 by 1.0 meters, the high-volume printer achieves a core cycle time of as little as five seconds for maximum throughput. With its use of precise linear drives, off-belt printing, innovative clamping systems and an advanced print head, the DEK TQ achieves a wet-printing accuracy of ±17.5 µm @ 2 Cpk – more than enough to reliably print the pads for 0201 metric components and modern ultra-fine-pitch applications. Each machine comes with an external capability certification. Open interfaces like IPC-Hermes-9852, Closed-Loop-to-SPI, ASM OIB and IPC CFX make it easy to integrate the DEK TQ into a smart integrated factory. They also deliver additional investment protection. With its highly efficient understencil cleaning system featuring an extra-large fabric roll and additional tanks as well as its automatic print head and dispenser system, the printer can run for up to 8 hours with no operator assist.
Suggested Items
Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC
05/16/2024 | Indium CorporationIndium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado.
Indium Experts to Present at Electronics in Harsh Environments SMTA Conference
05/13/2024 | Indium Corporationndium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will deliver both a workshop and technical presentation at the Electronics in Harsh Environments SMTA Conference on May 14-16 in Copenhagen, Denmark.
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.