Efabless Extends Partnerships for Rapid Development Solution of Custom ICs
October 1, 2020 | Globe NewswireEstimated reading time: 2 minutes

Efabless Corporation, the leading open innovation platform for IC design, announced a collaboration with imec, a world-leading research and innovation hub in nanoelectronics and digital technologies to support customers with low-cost rapid solutions for IC development. The solutions enable a broad range of customers with diverse areas of expertise, to create or have created, custom ICs supporting their products or technologies. The partnership enhances these solutions to leverage imec’s world-class supply chain solution for fabrication, assembly and test.
The solution is based on automated configurable design templates. The initial SoC Design Templates are based on X-FAB 180nm process technology and include a broad selection of analog and digital peripherals that can be readily configured into a design.
By choosing templates based on specific application requirements, custom SoC designs are automatically generated from a web-based UI using drop-down menus. The solution enables designers to create a complete SoC without needing expertise for the full chip design. For customers who need turn-key or partial design services, cost and time-to-market can be reduced as much as 3-5x through leveraging automated design generation and development on the Efabless platform.
Custom analog or digital block can be readily incorporated enabling further customization and providing a means to create a complete controller around customer developed IP. The solution is great for customers looking to build initial POCs or developing first product iterations. Unlike FPGAs, custom ICs (ASICs) support rich analog and digital mixed-signal designs and can provide better speed, cost and power consumption.
Romano Hoofman, Program Director at imec comments: “For many years, imec has supported customers and provided them with access to leading-edge foundries such that those customers can realize their ideas in silicon. The Efabless platform is great for customers who are looking for a low-cost, easy and fast route to fabrication of their ASIC solutions. Our collaboration will start with support for the XH018 technology from X-FAB, but we will add more technologies and foundries to the Efabless platform in the coming years.”
“We are very excited to be working with imec to eliminate traditional barriers for IC creation. We share a common vision for a simplified solution to address a large growing demand for custom electronics driven by requirements for intelligent connected products. By providing a complete path for many more designers to quickly and cost-effectively turn their innovative ideas into commercial products, imec and Efabless are taking a big step in making this vision a reality,” said Jeff DiCorpo, SVP Business Development at Efabless.
Suggested Items
Material Selection and RF Design
04/21/2025 | Andy Shaughnessy, Design007 MagazineInnovation rarely sleeps in this industry, and the RF laminate segment offers a perfect example. RF materials have continued to evolve, providing PCB designers much more than an either/or choice. I asked materials expert Alun Morgan, technology ambassador for the Ventec International Group, to walk us through the available RF material sets and how smart material selection can ease the burden on RF designers and design engineers.
Real Time with... IPC APEX EXPO 2025: Aster–Enhancing Design for Effective Testing Strategies
04/18/2025 | Real Time with...IPC APEX EXPOWill Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.
Real Time with... IPC APEX EXPO 2025: Emerging Trends in Design and Technology
04/16/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy speaks with IPC design instructor Kris Moyer to discuss emerging design trends. They cover UHDI technology, 3D printing, and optical data transmission, emphasizing the importance of a skilled workforce. The role of AI in design is highlighted, along with the need for understanding physics and mechanics as designs become more complex. The conversation concludes with a focus on enhancing math skills for better signal integrity.
Electronic System Design Industry Posts $4.9 Billion in Revenue in Q4 2024
04/15/2025 | SEMIElectronic System Design (ESD) industry revenue increased 11% to $4,927.3 million in the fourth quarter of 2024 from the $4440.9 million reported in the fourth quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.
Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
04/17/2025 | Matt Stevenson -- Column: Connect the DotsIf you have read any of my earlier columns, you know I am passionate about helping designers design for the reality of manufacturing. Designing for manufacturability (DFM) is a team sport. DFM is a design process that looks forward to the manufacturing process and integrates with it so that manufacturing requirements and capabilities can be accurately reflected in the design work.