The Marketing Minute: Staying Positive When the Market Isn’t
Marcy’s Musings: Continuing to Invent the Future With SEL
It’s Only Common Sense: Why Failure Is an Opportunity for Growth
LPKF Delivers First AMP Laser System for Volume Manufacturing of IC Packages
October 8, 2020 | LPKFEstimated reading time: 2 minutes
LPKF’s Active Mold Packaging (AMP) technology enables electrical circuits directly on the surface and inside the volume of the epoxy mold compound. This contributes to cost and space savings in advanced packaging manufacturing, and to a higher functional density of finished ICs. In addition, AMP helps to reduce power consumption, improves heat dissipation for power applications, enables additive 2L EMC-RDL formation and enables a whole suite of RF applications relevant for use in 5G. Taken together, these key factors contribute to a meaningful advance of the semiconductor industry. Starting now, the advantages made possible by AMP are leveraged by a large OEM manufacturer of integrated circuits in one of its production sites in South-East Asia. Together with LPKF, the company recently installed an LPKF system, which will make the AMP process available for high volume manufacturing in advanced packaging applications.
More than ever, innovative solutions for mounting and connection technology are crucial factors in the semiconductor industry. Functional integration of the kind made possible by AMP technology is another signifi-cant step towards this goal. Active Mold Packaging simplifies integrated circuits (ICs) and systems-in-package (SiPs), and it increases value add for the users. When using AMP, the epoxy molding compound (EMC) – previously used only to protect ICs or SiPs – is converted into an active carrier of electrical functionality. The simple, time-saving, and reliable 2.5D packaging approach of AMP is based on three proven and standardized electronic production technologies: EMC encapsulation, laser processing using laser direct structuring (LDS), and selective metallization of the laser-processed areas with copper.
A new class of epoxy molding compounds (EMCs) has been developed for the laser direct structuring (LDS) process and is available in granulate and tablet form from a selection of well-known suppliers. In addition, this material is well suited for the plating process. In this process, laser direct structuring can reach a resolution range of 25µm for each linewidth and space.
Active Mold Packaging enables direct, electrically conducting connections between active and passive components in an IC or SiP. This shortens electrical path lengths and thus ohmic resistance and induct-ance.
Target applications of AMP are currently being developed for the 5G technology segment, and also for “beyond 5G” (B5G) – or 6G – RF technologies. They can apply to a wide range of uses: mmWave antennae as antenna-in/on-package (AiP/AoP) modules that operate in ISM bands at e.g. 24 GHz, 61 GHz, and 121 GHz, vehicle radar modules that operate between 76 GHz and 81 GHz, 5G amplifiers, or even EMI shielding. Other applications are package-on-package (PoP), 2L interposers, multi-chip modules (MCMs), thermal management and SiP connections.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
How Good Design Enables Sustainable PCBs
08/21/2025 | Gerry Partida, Summit InterconnectSustainability has become a key focus for PCB companies seeking to reduce waste, conserve energy, and optimize resources. While many discussions on sustainability center around materials or energy-efficient processes, PCB design is an often overlooked factor that lies at the heart of manufacturing. Good design practices, especially those based on established IPC standards, play a central role in enabling sustainable PCB production. By ensuring designs are manufacturable and reliable, engineers can significantly reduce the environmental impact of their products.
50% Copper Tariffs, 100% Chip Uncertainty, and a Truce
08/19/2025 | Andy Shaughnessy, I-Connect007If you’re like me, tariffs were not on your radar screen until a few months ago, but now political rhetoric has turned to presidential action. Tariffs are front-page news with major developments coming directly from the Oval Office. These are not typical times. President Donald Trump campaigned on tariff reform, and he’s now busy revamping America’s tariff policy.
Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
08/14/2025 | Markus Voeltz -- Column: Global PCB ConnectionsDesigners don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.
MKS’ Atotech to Participate in IPCA Electronics Expo 2025
08/11/2025 | AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands ESI® (laser systems) and Atotech® (process chemicals, equipment, software, and services) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 17th IPCA Show to be held at Pragati Maidan, New Delhi from August 21-23, 2025.
MKS Showcases Next-generation PCB Manufacturing Solutions at the Thailand Electronics Circuit Asia 2025
08/06/2025 | MKS Instruments, Inc.MKS Inc, a global provider of enabling technologies that transform our world, today announced its participation in Thailand Electronics Circuit Asia 2025 (THECA 2025), taking place August 20–22 at BITEC in Bangkok.