The Marketing Minute: Staying Positive When the Market Isn’t
Marcy’s Musings: Continuing to Invent the Future With SEL
It’s Only Common Sense: Why Failure Is an Opportunity for Growth
Lattice Semiconductor Wins Two Medals at 2020 LEAP Awards
October 14, 2020 | Business WireEstimated reading time: 1 minute
Lattice Semiconductor Corporation, a low power programmable leader, announced that both the Lattice Propel™ design environment and the Lattice CrossLink™-NX FPGA family won medals at the 2020 Leadership in Engineering Achievement Program (LEAP) Awards. Propel received a gold medal in the Software category and CrossLink-NX won a bronze medal in the Embedded Computing category.
Presented by WTWH Media, the LEAP Awards honor outstanding products for use in industrial application design. This year’s winners were chosen by an independent judging panel of 14 industrial engineering and academic professionals. In selecting Lattice Propel for the gold medal, the judges commented: “Lattice structures create enormous potential in the area of design for additive manufacturing.”
Roger Do, Senior Product Line Manager at Lattice, said: “The Lattice Propel design environment lets developers leverage the low-power performance of Lattice FPGAs in their industrial applications, regardless of their familiarity with FPGA design. Our CrossLink-NX FPGAs enable smart and embedded vision applications with class-leading low power consumption and performance. Receiving LEAP Awards for these products is particularly meaningful as the judging committee consists of leaders in industrial academia and engineering, and we thank them for recognizing Lattice’s hard work and innovation.”
Industrial developers building embedded vision, artificial intelligence, and security applications need design solutions that are flexible, easy-to-use, and integrate all required design software and IP. The Lattice Propel design environment is a compelling, intuitive, and powerful tool that accelerates development of Lattice FPGA-based designs. With Lattice Propel, developers can quickly and easily build, compile, analyze, and debug application systems. By combining system hardware integration and software design into one tool framework, Lattice Propel enables developers to write system software before hardware is available and get their products to market faster.
CrossLink-NX FPGAs deliver the best-in-class low power consumption, small form factor, reliability, and performance that developers need to create innovative embedded vision and AI solutions for compute, industrial, automotive, and consumer applications. The CrossLink-NX family was designed using the Lattice Nexus™ FPGA platform, the industry’s only low power FPGA platform using a 28 nm FD-SOI manufacturing process. The LEAP Award is the second industry award that the CrossLink-NX family has received since its launch less than a year ago.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
I-Connect007 Editor's Choice: Five Must-Reads for the Week
08/22/2025 | Andy Shaughnessy, I-Connect007In this week’s roundup, we have a variety of articles covering design, manufacturing, sustainability, and, of course, tariff negotiations. We have a milestone anniversary to celebrate as well, with Dan Beaulieu about to publish his 1,000th column. When does Dan even sleep? Here’s to hoping that we have 1,000 more weeks of "It’s Only Common Sense."
New Episode Drop: MKS’ ESI’s Role in Optimize the Interconnect
08/21/2025 | I-Connect007In this latest episode, Casey Kruger, director of product marketing at MKS’ ESI, joins On the Line With… host Nolan Johnson to share how CO₂ laser technology delivers faster, more accurate vias in a smaller, more energy-efficient footprint.
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
How Good Design Enables Sustainable PCBs
08/21/2025 | Gerry Partida, Summit InterconnectSustainability has become a key focus for PCB companies seeking to reduce waste, conserve energy, and optimize resources. While many discussions on sustainability center around materials or energy-efficient processes, PCB design is an often overlooked factor that lies at the heart of manufacturing. Good design practices, especially those based on established IPC standards, play a central role in enabling sustainable PCB production. By ensuring designs are manufacturable and reliable, engineers can significantly reduce the environmental impact of their products.
Meet the Round 1 Winners of the Bright Manufacturing Student Challenge 2025
08/20/2025 | Tara Dunn, SMTAThe Bright Manufacturing Student Challenge is an opportunity for student teams to design and develop innovative solutions for real-world electronics manufacturing problems. The eight-week competition, sponsored by the Electronics Manufacturing & Assembly Collaborative (EMAC) through electronicsworkforce.com, allows students to showcase their technical skills, creativity, and problem-solving abilities.