Showa Denko Markets PNVA 'GE191 Series'
October 19, 2020 | ACN NewswireEstimated reading time: 2 minutes

Showa Denko starts full-swing marketing of Poly-N-vinylacetamide (PNVA(TM)) optimized for use as a binder to form heat-resisting ceramic layer in separators to be used in lithium-ion batteries (LIBs), under the trade name of "GE191 Series."
PNVA is a water-soluble polymer synthesized through polymerization of N-vinylacetamide, and SDK is the only company in the world which produce N-vinylacetamide on a commercial basis. PNVA is designed to have many hydrogen bonds. It has heat-resisting property, and can make oxided-metal particles disperse uniformly and stably. "GE191 Series" is a grade of PNVA that fulfills requirements for use as heat-resisting ceramic layer, and contributes to improvement in heat-resisting property and thinness of the layer. Thus GE191 Series is acclaimed as additive for separators in LIBs that can improve safety and durability of LIBs through improvement in heat-resisting property of coating layers in separators, and adopted for use in onboard LIBs.
Conventional separator of LIB consists of thin films of polyethylene, polypropylene and other materials. If an LIB generates heat abnormally and its temperature rises, crystals in separators melt, separating films shrink, electrodes contact each other and short-circuit, and there may be a serious accident such as fire. If separator of LIB is coated with heat-resisting ceramic layer to which SDK's "GE191 series" is added, GE191 Series gives heat-resisting property to the separator. In addition, inorganic particles in the heat-resisting layer including alumina and boehmite and particles of GE191 Series are bonded strongly through hydrogen bonding. This heat-resisting layer protects the shape of separator against abnormal heat, and reduces risk of contact and short-circuiting between electrodes.
Furthermore, GE191 Series has high-hydrophilicity and high-viscosity-thickening property (high rheological property), keeps high viscosity of coating materials even under low stress due to uniform disperse of ceramic particles, and has excellent thixotropic property (the property of becoming less viscous when subjected to an applied stress). Therefore, use of GE191 Series as binder for separator gives high-storage-durability (sedimentation-resisting property) to heat-resisting ceramic layer, and enable LIB manufacturers to coat separators and electrodes speedily and improve efficiency of coating process, thereby contributing to cost reduction through cutting in loss of coating materials.
Global LIB market is expected to continue rapid growth due to the progress in 5G telecommunication technology and CASE (connected, autonomous/automated, shared, electric) related automotive technologies. SDK has many products that improve performance of LIBs including PNVA, aqueous binder resin "POLYSOL(TM)," pouch-type LIB packaging material "SPALF(TM)," and additive for anode and cathode "VGCF(TM)." Making the most of these products, SDK will aim to expand its LIB material business further through provision of optimum solutions that respond to the demands of customers.
Suggested Items
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Gorilla Circuits Elevates PCB Precision with Schmoll’s Optiflex II Alignment System
06/23/2025 | Schmoll MaschinenGorilla Circuits, a leading PCB manufacturer based in Silicon Valley, has enhanced its production capabilities with the addition of Schmoll Maschinen’s Optiflex II Post-Etch Punch system—bringing a new level of precision to multilayer board fabrication.
Sierra Circuits Boosts High Precision PCB Manufacturing with Schmoll Technology
06/16/2025 | Schmoll MaschinenSierra Circuits has seen increased success in production of multilayer HDI boards and high-speed signal architectures through the integration of a range of Schmoll Maschinen systems. The company’s current setup includes four MXY-6 drilling machines, two LM2 routing models, and a semi-automatic Optiflex II innerlayer punch.
Elementary, Mr. Watson: PCB Routing: The Art—and Science—of Connection
06/11/2025 | John Watson -- Column: Elementary, Mr. WatsonMany people who design circuit boards love the routing part of the design. This is partially because we want to stop looking at the annoying rat's nest of connections, which seem to have no rhyme or reason at first glance. We want to get to something more exciting. Routing is the ultimate part of solving the puzzle. You take all the messy lines from the schematic and turn them into neat, organized paths.