The Marketing Minute: Staying Positive When the Market Isn’t
Marcy’s Musings: Continuing to Invent the Future With SEL
It’s Only Common Sense: Why Failure Is an Opportunity for Growth
Showa Denko Markets PNVA 'GE191 Series'
October 19, 2020 | ACN NewswireEstimated reading time: 2 minutes
Showa Denko starts full-swing marketing of Poly-N-vinylacetamide (PNVA(TM)) optimized for use as a binder to form heat-resisting ceramic layer in separators to be used in lithium-ion batteries (LIBs), under the trade name of "GE191 Series."
PNVA is a water-soluble polymer synthesized through polymerization of N-vinylacetamide, and SDK is the only company in the world which produce N-vinylacetamide on a commercial basis. PNVA is designed to have many hydrogen bonds. It has heat-resisting property, and can make oxided-metal particles disperse uniformly and stably. "GE191 Series" is a grade of PNVA that fulfills requirements for use as heat-resisting ceramic layer, and contributes to improvement in heat-resisting property and thinness of the layer. Thus GE191 Series is acclaimed as additive for separators in LIBs that can improve safety and durability of LIBs through improvement in heat-resisting property of coating layers in separators, and adopted for use in onboard LIBs.
Conventional separator of LIB consists of thin films of polyethylene, polypropylene and other materials. If an LIB generates heat abnormally and its temperature rises, crystals in separators melt, separating films shrink, electrodes contact each other and short-circuit, and there may be a serious accident such as fire. If separator of LIB is coated with heat-resisting ceramic layer to which SDK's "GE191 series" is added, GE191 Series gives heat-resisting property to the separator. In addition, inorganic particles in the heat-resisting layer including alumina and boehmite and particles of GE191 Series are bonded strongly through hydrogen bonding. This heat-resisting layer protects the shape of separator against abnormal heat, and reduces risk of contact and short-circuiting between electrodes.
Furthermore, GE191 Series has high-hydrophilicity and high-viscosity-thickening property (high rheological property), keeps high viscosity of coating materials even under low stress due to uniform disperse of ceramic particles, and has excellent thixotropic property (the property of becoming less viscous when subjected to an applied stress). Therefore, use of GE191 Series as binder for separator gives high-storage-durability (sedimentation-resisting property) to heat-resisting ceramic layer, and enable LIB manufacturers to coat separators and electrodes speedily and improve efficiency of coating process, thereby contributing to cost reduction through cutting in loss of coating materials.
Global LIB market is expected to continue rapid growth due to the progress in 5G telecommunication technology and CASE (connected, autonomous/automated, shared, electric) related automotive technologies. SDK has many products that improve performance of LIBs including PNVA, aqueous binder resin "POLYSOL(TM)," pouch-type LIB packaging material "SPALF(TM)," and additive for anode and cathode "VGCF(TM)." Making the most of these products, SDK will aim to expand its LIB material business further through provision of optimum solutions that respond to the demands of customers.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
08/14/2025 | Markus Voeltz -- Column: Global PCB ConnectionsDesigners don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/08/2025 | Andy Shaughnessy, I-Connect007If you’ve been watching the news lately, you might be tempted to opine, “What’s going on here?” In this week’s must-reads, we have a wrap-up of the latest news about U.S. tariffs with Asia, and columnist Tom Yang explains why some PCB fabrication business should remain in China. We also have a piece that examines the unprecedented growth that green manufacturing is expected to see over the next four years.
Driving Innovation: Inner Layer Alignment Methods in PCB Production
08/06/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, precision is a fundamental requirement. Among many complex processes, the accurate registration of inner layers before lamination is one of the most critical. Much like a child's game where rings must be perfectly stacked onto a single pin, PCB manufacturers align multiple conductive and insulating layers to form a cohesive, functional board. This alignment directly affects PCB precision; tighter layer alignment results in smaller "annular rings," superior performance, and higher yields.
NCAB Breaks Down Updated Tariff Rate Change
08/04/2025 | NCAB GroupThese are the new tariff rates that will go into effect Aug. 7, 2025 at 12:01am EST. Any shipments entering U.S. customs after this time will be affected.
Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
07/31/2025 | Matt Stevenson -- Column: Connect the DotsAs HDI technology becomes mainstream in high-speed and miniaturized electronics, understanding the PCB manufacturing process can help PCB design engineers create successful, cost-effective designs using advanced technologies. Designs that incorporate blind and buried vias, boards with space constraints, sensitive signal integrity requirements, or internal heat dissipation concerns are often candidates for HDI technology and usually require sequential lamination to satisfy the requirements.