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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Dymax to Highlight Adhesive and Light-Curing Solutions for Next-Generation Electronics at SMTA International

10/20/2026 | Dymax
Demonstrating technologies that help electronics manufacturers improve reliability, efficiency, and process consistency.

Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough

10/14/2026 | Chandra Gupta -- Column: Below the Surface
In previous columns, I’ve described the ceramic substrate itself, talking about why material choice matters so deeply in electronics, RF, microwave, and millimeter-wave applications. Dielectric constant, loss tangent, thermal conductivity, and stability across temperature and frequency are the physical rules that govern whether a signal arrives intact or collapses into noise. But focusing only on the substrate is a bit like judging a city solely by its geology. Bedrock matters, of course.

Wistron Showcases at 2026 OCP Global Summit

10/13/2026 | Wistron
Wistron Corporation and Wiwynn Corporation are participating in the 2026 OCP Global Summit in San Jose, California, under the theme “Create AI Beyond Limits,” showcasing a range of AI solutions and technology applications. ​​​​

Qnity Expands Thermal Management Solutions for AI Memory Cooling

10/13/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced two new advanced memory cooling solutions leveraging Laird™ Graphite-over-Foam (GOF) and Laird™ Thermal Interface Material (TIM) technologies.

GlobalFoundries, TSMC Agree on U.S. Silicon Interposer Supply for AI Packaging

10/12/2026 | GlobalFoundries
GlobalFoundries (GF) announced a manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC’s CoWoS® advanced packaging ecosystem. Under the agreement, GF will provide manufacturing service to TSMC, and add fabrication capacity at its Malta, New York facility, supporting growing demand for high-performance computing and AI systems.
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