Printable, High-Performance Solid-State Electrolyte Films for Next-Generation Batteries
November 19, 2020 | University of MarylandEstimated reading time: 1 minute
Lithium-ion batteries are widely used in portable electronic devices, electric vehicles, and grid-scale energy storage systems. Safety of the Li-ion batteries, however, has been called into question repeatedly over the past several years due to the conventional organic electrolyte causing fire and explosion in many cases. Ceramic solid-state electrolyte (SSE) thin film promises a viable solution to addressing the safety issue by blocking the lithium (Li) dendrite that causes the short circuit and thermal runaway, meanwhile offering high energy density for next generation Li-ion batteries. However, current SSE thin films have low ionic conductivities, ranging from 10?8 to 10?5 S/cm, which can be attributed to poor material quality.
A research team led by Liangbing Hu at the University of Maryland (UMD) College Park recently developed a new method of printing and sintering a variety of SSE thin films. This work, entitled, “Printable, high-performance solid-state electrolyte films,” was published on November 18, 2020, in Science Advances. The team named this method 'printing and radiative heating' (PRH), which features a solution-based printable technique followed by rapid sintering.
In a typical process, a precursor suspension is printed on a substrate, whose concentration and thickness can be adjusted. The high-quality and high-performance SSE thin film can then be obtained after rapid (~3 s) high-temperature (~1500°C) sintering, ensuring minimal Li loss and high crystallinity. This approach not only leads to dense and uniform microstructure for the SSE thin films, but also ensures superior ionic conductivity. Notably, the fabrication process – from precursor to final product – only takes ~5 min, which is ~100 times faster than conventional methods.
In a proof-of-concept demonstration, the team showed a printed garnet-based SSE thin film to have high ionic conductivity of up to 1 mS/cm and excellent cycling stability. In addition, the PRH method enables many other designs such as complex multilayer assembly without cross-contamination during synthesis. It can also be extended to preparing other ceramic thin films, which opens up new opportunities in developing safe and high-performance solid-state batteries and other thin-film-based devices.
Suggested Items
Standard of Excellence: Delivering Excellence—A Daily Goal
06/25/2025 | Anaya Vardya -- Column: Standard of ExcellenceDelivering excellence consistently across all touchpoints is essential for organizations aiming to build trust, foster customer loyalty, and maintain their brand reputation. This requires a strategic approach encompassing uniform messaging, standardized service protocols, employee training, performance monitoring, and seamless integration across platforms.
Global PCB Connections: Embedded Components—The Future of High-performance PCB Design
06/19/2025 | Jerome Larez -- Column: Global PCB ConnectionsA promising advancement in this space is the integration of embedded components directly within the PCB substrate. Embedded components—such as resistors, capacitors, and even semiconductors—can be placed within the internal layers of the PCB rather than mounted on the surface. This enables designers to maximize available real estate and improve performance, reliability, and manufacturability.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
Keysight, Synopsys Deliver an AI-Powered RF Design Migration Flow
06/06/2025 | BUSINESS WIREKeysight Technologies, Inc. and Synopsys, Inc. introduced an AI-powered RF design migration flow to expedite migration from TSMC’s N6RF+ process to N4P technology, to address the performance requirements of today’s most demanding wireless integrated circuit applications.
AMD Acquires Brium to Strengthen Open AI Software Ecosystem
06/05/2025 | AMDAt AMD, we’re committed to building a high-performance, open AI software ecosystem that empowers developers and drives innovation. Today, we’re excited to take another step forward with the acquisition of Brium, a team of world-class compiler and AI software experts with deep expertise in machine learning, AI inference, and performance optimization.