CSC Celebrates First Visualization Suite Opening in Ottawa
November 27, 2020 | BAE SystemsEstimated reading time: 1 minute

BAE Systems was proud to open the first Visualization Suite for the Canadian Surface Combatant (CSC) officially on 26 November at its offices in Ottawa.
BAE Systems were honoured to mark the occasion with Minister of National Defence Harjit Sajjan, and Commander of the Royal Canadian Navy Vice Admiral Art McDonald in attendance for a tour of the suite.
The visualization technology will transform the way warships are designed, built and delivered for the Royal Canadian Navy. Using the technology to create a virtual prototype and “Digital Twin” enables a deep understanding of the vessel and the experience of those serving on board before manufacturing begins.
The technology allows a fully detailed view of the ship’s design from any angle or area with the ability to inspect and examine equipment and systems quickly and easily, a key benefit in maturing and ensuring design, and in supporting the program’s prime contractor, Irving Shipbuilding, as it plans for build. Our engineers are able to mature design across countries and time zones, working together with our partners and customer to create the right ship for Canada.
The Canadian Surface Combatant is being designed to meet Canada’s unique needs and will deliver immense economic benefits in Canada from across the program team. Our visualisation technology promotes efficiency, quality and safety in the CSC program for the Royal Canadian Navy and the Government of Canada.
The CSC team, includes BAE Systems as ship designer, Lockheed Martin Canada leading the design team and Irving Shipbuilding as prime contractor who will build the CSC at their Halifax Shipyard. Over 10,000 people are employed in Canada collectively across all the partner companies supporting the design of the Canadian Surface Combatant, with thousands more in long-term, high-value job creation.
Across our three Global Combat Ship programs in Canada, the UK and Australia, 3D visualization suites pioneered by BAE Systems in the UK for the Type 26 program are transforming how ships are designed.
Suggested Items
Bell to Build X-Plane for Phase 2 of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
07/09/2025 | Bell Textron Inc.Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 2 of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program with the objective to complete design, construction, ground testing and certification of an X-plane demonstrator.
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.