Würth Elektronik Organized 'WE meet @ digital days 2020'
December 11, 2020 | Würth ElektronikEstimated reading time: 2 minutes
Würth Elektronik organized the "WE meet @ digital days 2020" from December 1st to 3rd, starting from 8:00 to 18:00 o'clock per day. A total of 30 digital live presentations took place, hosted by Würth Elektronik experts for electronic & electromechanical components. The hosts shared insights into current challenges and trends in electronics design as well as information on new solutions and components. With more than 2,300 participants, the virtual conference proved to be a successful way of staying in touch digitally with customers, interested parties and developers from a wide range of industries. Questions were answered live via a chat function or subsequently by e-mail.
The international composition of the participants at Würth Elektronik's event showed how much the new forms of communication and meetings with their efficiency are appreciated: More than 2,300 participants from almost all regions of the world - from Europe, the USA, India, China, other Asian countries, Africa, the Middle East and other regions - were selected. The presentations from the divisions Passive & Electromechanical Components, Power Modules & Optoelectronics, Automotive, Frequency Products as well as Wireless Connectivity & Sensors clearly showed the speakers' enthusiasm for their respective fields: One participant described the contributions of the experts, some of whom were connected from their home offices, as "very personal video conferences with people who know their way around". Many developers used the chat function to get answers to specific questions from current projects. Among the conference visitors' favorites by number of participants were the topics "How cable and PCB ferrites can help to avoid EMC problems", "EMC filters - from component to design" or "Board level shielding and the treatment of common mode interference in new high frequency technologies."
Thomas Schrott, CEO of the Würth Elektronik eiSos Group, is impressed by the event: "These times bring many challenges - the loss of personal contacts at trade fairs is one of them. The virtual conference is a way to communicate innovations and thus open up new design possibilities for developers".
"Consulting and design-in support are part of our service. The technical presentations showed how great the interest is in the electronics market", says Alexander Gerfer, CTO at the Würth Elektronik eiSos Group, and Thomas Wild, CFO at the Würth Elektronik eiSos Group, adds: "The reactions showed how important know-how transfer is and how the topics hit the nerve of many developers. My thanks go to the team that selected the topics and organized the digital conference".
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Cadence Giving Foundation Announces Multi-Year Commitment to Expand the AI Hub at San José State University
10/13/2025 | Cadence Design Systems, Inc.The Cadence Giving Foundation today announced a multi-year commitment to expand the AI Hub at San José State University (SJSU) to equip students with the skills, hands-on training and experience needed to excel in careers in artificial intelligence (AI).
NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
10/13/2025 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking.
Sumitomo Riko Boosts Automotive Design Efficiency 10x with Ansys AI Simulation Technology
10/13/2025 | SynopsysSumitomo Riko is implementing Ansys, part of Synopsys, Inc. AI technology to accelerate time-to-solution and improve efficiency during the design and manufacturing of automotive components.
Si2 Names NVIDIA, Synopsys Technologists to Lead New LLM Benchmarking Coalition
10/10/2025 | BUSINESS WIREThe Silicon Integration Initiative today announced the chair and vice chair of the Si2 Large Language Model Benchmarking Coalition (LBC), a collaborative industry initiative and standards body advancing AI for silicon design and verification that will expedite the development of high-quality large language models for semiconductor design problems.
Quilter Secures $25M Series B to Eliminate Manual PCB Design with Physics-Driven AI
10/09/2025 | BUSINESS WIREQuilter, the first and only company to publicly demonstrate fully autonomous PCB layout through physics-driven AI, announced $25 million in Series B funding led by Index Ventures.