NIO Partners with NVIDIA to Develop New Generation of Automated Driving EVs
January 11, 2021 | NVIDIA NewsroomEstimated reading time: 1 minute
NIO, a pioneer in China’s premium smart electric vehicle market, and NVIDIA announced that the automaker has selected the NVIDIA DRIVE Orin™ system-on-a-chip (SoC) for its new generation of electric vehicles, which will offer advanced automated driving capabilities.
NIO is working to make consumer adoption of smart, performance-packed electric vehicles a widespread reality. At NIO Day, the company’s annual customer event, the EV maker revealed its NVIDIA DRIVE Orin-powered supercomputer, dubbed Adam, which will first appear in the ET7 sedan that will ship in China starting in 2022.
“Autonomy and electrification are the key forces transforming the automotive industry,” said Jensen Huang, NVIDIA founder and CEO. “We are delighted to partner with NIO, a leader in the new energy vehicle revolution — leveraging the power of AI to create the software-defined EV fleets of the future.”
“The cooperation of NIO and NVIDIA will accelerate the development of autonomous driving on smart vehicles. NIO’s in-house developed autonomous driving algorithms will be running on four industry-leading NVIDIA Orin processors, delivering an unprecedented 1000+ TOPS in production cars,” said William Li, founder, chairman and CEO of NIO.
Adam signals a major achievement by NIO in bringing automotive intelligence and autonomous driving to market, safely and reliably. With a centralized, software-defined computing architecture, NIO’s next-generation EVs, like the ET7 sedan, will feature the latest AI-enabled capabilities, which are perpetually upgradable after the point of sale.
NVIDIA Orin is the world’s highest-performance AV and robotics processor. This scalable supercomputer-on-a-chip family delivers an unprecedented 254 trillions of operations per second (TOPS) while also being able to scale down to entry-level ADAS/Level 2 use cases (10 TOPS/5 watts). NIO will feature four high-performance Orin SoCs in each of its EVs to achieve an industry-leading performance of 1,000+ TOPS — delivering the redundancy and diversity necessary for safe autonomous operation.
As the first of NIO’s EVs to feature Orin, the flagship ET7 is a high-performance vehicle that accelerates from zero to 100km in only 3.9 seconds. It also features a new 150kw battery for extended mileage range.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Macronix Introduces Cutting-Edge Secure-Boot NOR Flash Memory
08/08/2025 | PRNewswireMacronix International Co., Ltd., a leading integrated device manufacturer in the non-volatile memory (NVM) market, announced ArmorBoot MX76, a robust NOR flash memory combining in a single device, the essential performance and an array of security features that deliver rapid boot times and iron-clad data protection.
UHDI Fundamentals: UHDI Technology and Industry 4.0
08/05/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
Advint and Sayron Bring Advanced Rectifier Solutions to High-Reliability PCB Manufacturers
08/01/2025 | Advint IncorporatedAdvint Incorporated has partnered with Sayron, a leading global rectifier manufacturer, to supply cutting-edge IGBT-based DC rectifiers to high-performance PCB manufacturers across North America and beyond. Sayron’s precision-engineered rectifiers align with the stringent requirements of advanced PCB processes.
Teramount Raises $50M to Address Growing Demand for AI Infrastructure Optical Connectivity
07/31/2025 | PRNewswireTeramount, the leader in scalable fiber-to-chip interconnect solutions for AI, data centers and advanced computing, today announced it has raised $50 million in financing led by new investor Koch Disruptive Technologies (KDT). Existing investors Grove Ventures and several new strategic investors, including AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron, joined the round.
KOKI to Showcase Analytical Services and New HF1200 Solder Paste at SMTA Guadalajara 2025
07/31/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, will exhibit at the SMTA Guadalajara Expo & Tech Forum, taking place September 17 & 18, 2025 at Expo Guadalajara, Salón Jalisco Halls D & E in Guadalajara, Mexico.