It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Alpha Insights, Performance by Design: The Future of PCB Manufacturing in the Midwest
Happy’s Tech Talk #43: Engineering Statistics Training With Free Software
NIO Partners with NVIDIA to Develop New Generation of Automated Driving EVs
January 11, 2021 | NVIDIA NewsroomEstimated reading time: 1 minute
NIO, a pioneer in China’s premium smart electric vehicle market, and NVIDIA announced that the automaker has selected the NVIDIA DRIVE Orin™ system-on-a-chip (SoC) for its new generation of electric vehicles, which will offer advanced automated driving capabilities.
NIO is working to make consumer adoption of smart, performance-packed electric vehicles a widespread reality. At NIO Day, the company’s annual customer event, the EV maker revealed its NVIDIA DRIVE Orin-powered supercomputer, dubbed Adam, which will first appear in the ET7 sedan that will ship in China starting in 2022.
“Autonomy and electrification are the key forces transforming the automotive industry,” said Jensen Huang, NVIDIA founder and CEO. “We are delighted to partner with NIO, a leader in the new energy vehicle revolution — leveraging the power of AI to create the software-defined EV fleets of the future.”
“The cooperation of NIO and NVIDIA will accelerate the development of autonomous driving on smart vehicles. NIO’s in-house developed autonomous driving algorithms will be running on four industry-leading NVIDIA Orin processors, delivering an unprecedented 1000+ TOPS in production cars,” said William Li, founder, chairman and CEO of NIO.
Adam signals a major achievement by NIO in bringing automotive intelligence and autonomous driving to market, safely and reliably. With a centralized, software-defined computing architecture, NIO’s next-generation EVs, like the ET7 sedan, will feature the latest AI-enabled capabilities, which are perpetually upgradable after the point of sale.
NVIDIA Orin is the world’s highest-performance AV and robotics processor. This scalable supercomputer-on-a-chip family delivers an unprecedented 254 trillions of operations per second (TOPS) while also being able to scale down to entry-level ADAS/Level 2 use cases (10 TOPS/5 watts). NIO will feature four high-performance Orin SoCs in each of its EVs to achieve an industry-leading performance of 1,000+ TOPS — delivering the redundancy and diversity necessary for safe autonomous operation.
As the first of NIO’s EVs to feature Orin, the flagship ET7 is a high-performance vehicle that accelerates from zero to 100km in only 3.9 seconds. It also features a new 150kw battery for extended mileage range.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/03/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.
Target Condition: Rethinking the PCB Stackup Recipe
10/01/2025 | Kelly Dack -- Column: Target ConditionMarie Antoinette is attributed with saying, “Let them eat cake,” but historians now agree she likely never said it. It was probably revolutionary propaganda to paint her as out of touch with the starving masses. Yet, the phrase still lingers, and oddly enough, it applies to the world of PCB design.
Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025
09/25/2025 | Empower SemiconductorEmpower Semiconductor, the world leader in powering AI-class processors, announced that its Crescendo chipset, an artificial intelligence (AI) and high-performance computing (HPC) processor true vertical power delivery platform, is available now for final sampling, with mass production slated for late 2025.