Nano Dimension Strengthening its Leadership Position in 3D Printed Electronics with AME Design Methodology
January 13, 2021 | Nano Dimension Ltd.Estimated reading time: 1 minute

Nano Dimension Ltd., a leading Additively Manufactured Electronics (AME)/PE (Printed Electronics) provider, offers quick solutions and easy access to complex PCBs and 3D printed electronics. Its unique and novel technology allows for rapid prototyping and production of high-performance electronic devices (Hi-PEDs™).
Nano Dimension offers two solutions:
A. DragonFly LDM® 3D-printing system for Hi-PEDs catering to cross-industry needs by enabling in-house printing of free-form, complex, multiple layered boards.
B. A printing service dubbed, NaNoS?, for entities that wish to explore 3D printing of their own designs while gaining access to Nano’s 3D printing and design experts.
“Nano Dimension bridges the gap between PCB and semiconductor integrated circuits,” said Yoav Stern, CEO of Nano Dimension. “A revolution at the click of a button: From CAD to a functional high-performance AME device in hours, solely for the cost of the consumable materials. The DragonFly LDM® should be in everyone’s design workshop for rapid prototyping and testing. AME technology provides the capability to design and create free-form, multilayer complex circuit boards, bringing companies one-step closer to industry 4.0. With NaNoS?, the AME fabrication service becomes the first point of contact and an effective and affordable exploration of AME technology’s capabilities. This is a wake-up call for entities that wish to explore adoption of 3D revolutionary design, manufacturing, and fabrication technology.”
The DragonFly LDM® system enables in-house 3D printing of highly complex, multilayered circuits containing embedded capacitors, antennas, coils, converters, and electro-mechanical components, in just hours.
Nano Dimension’s DragonFly LDM® systems are utilized in cutting edge research institutes, such as CBN-IIT (Italy) and the University of Technology in Sydney (Australia). These institutes continuously expand the design envelope by breaking free from traditional 2D PCB design rules, resulting in miniaturized, performance enhanced 3D AME devices.
With approximately 60 systems sold worldwide, Nano Dimension is also cooperating with customers and partners such as Hensoldt (Germany), L3Harris (USA), and others, to provide insights into how AME technology can drive forward electronics’ design.
Nano Dimension has initiated a webinar-series where scientists and engineers share findings and AME-based solutions in 3D-printed 5G antennas, advanced microwave devices, embedding, micro-electromechanical systems (MEMS) packaging and heterogeneous integration. This knowledge sharing series provides a platform for the free flow of information and an open dialogue between industry experts who are looking for innovative solutions.
Suggested Items
Real Time with... IPC APEX EXPO 2025: Innovating Design—IPC's Vision for the Future
04/09/2025 | Real Time with...IPC APEX EXPOPeter Tranitz leads the IPC Design Initiative, which aims to enhance design offerings and engage the community, including the Design Leadership Council guiding future strategies. Peter talks about the IPC-hosted European electronics design conference, featuring peer-reviewed content and global participation. IPC's design initiative also tackles challenges, such as semiconductor scaling and AI integration, focusing on innovative co-design solutions.
Tariff Uncertainty Weighs on Display Demand, Pricing, and the Supply of AMOLED Materials,
04/09/2025 | TrendForceTrendForce reports that the U.S. began implementing reciprocal tariffs on April 9th, based largely on trade deficits. Consequently, Asia—particularly Southeast Asia, a key hub for the consumer electronics supply chain—has been significantly impacted.
Real Time with... IPC APEX EXPO 2025: Exploring Ventec's Innovations
04/09/2025 | Real Time with...IPC APEX EXPOMark Goodwin highlights Ventec's global distribution network and recent expansions in service and equipment offerings. He emphasizes the company's expertise in coating technology for thermal management, specialized materials, and its agility in creating customized solutions for customers.
Incap US Invests in Advanced SMT Technology
04/09/2025 | IncapIncap Electronics US invested approximately USD 2 million (EUR 1.82 million) in advanced SMT (surface-mount technology) production equipment to expand its production capacity.
Real Time with... IPC APEX EXPO 2025: Navigating Economic Headwinds in the Electronics Industry
04/08/2025 | Real Time with...IPC APEX EXPOShawn DuBravac, IPC Chief Economist, highlights the industry's resilience amid economic challenges, noting ongoing investment despite uncertainty and rising interest rates. Consumer behavior shows caution, with slowing spending and weakening confidence. A global economic overview reveals strengths in the U.S., challenges in China, and struggles in Europe. The discussion emphasizes the negative impact of tariffs and the importance of resilient supply chains.