MivaTek’s New Technology and Market Drivers
January 19, 2021 | Nolan Johnson, PCB007 MagazineEstimated reading time: 2 minutes
I recently spoke with Brendan Hogan about the upcoming new product releases from MivaTek. The conversation flows naturally from the new product’s market drivers to the X=Xc – 1 idea that is at the core of the market drivers.
Nolan Johnson: Brendan, I wanted to follow up and get your take on what is happening with imaging from your spot in the industry. Additionally, our 2021 theme at I-Connect007 is continuous improvement. We are using the tag line “X=Xc – 1.” The idea is that when we take one iteration out and improve those small steps throughout, we can start to create more efficiencies, better margins, more throughput. And when we’ve done it once, chances are good we can do it another time.
Brendan Hogan: Our point of development is right in that mix. Direct imaging eliminates several steps in the manufacturing process— phototools and manual registration is now obsolete. With the advent of Miva’s Quad-wave technology the same machine can “image anything” and without significant operator intervention. Direct imaging brings a certainty to the imaging process. Most of Europe and North America, let’s say, have some form of direct imaging which has improved the imaging process and capabilities. What Miva is focused on is solving the next element in the certainty question; total process certainty with digital imaging can influence plating quality, adapt to new scaling issues that result from the exotic material sets that are increasingly becoming less than “exotic.” How are we going to handle the technical demands three to five years out?
Miva Technologies has a great track record of working with companies and institutions developing new methods of manufacturing for technologies that will be on factory floors in the 3-5-year range.
Miva Technologies intended to demonstrate and announce its next technology offering at the IPC APEX EXPO in March. Unfortunately, due to COVID, a live trade show isn’t going to happen for the first time in my 35-year career. Miva Technologies and its sister company MivaTek Global will be announcing a live web demonstration date in the coming weeks.
Johnson: What can you tell us about the next offering from Miva Technologies?
Hogan: Our new offering will go way beyond the current concept of direct imaging. It is a broad re-thinking of the notion of digital imaging to establish tools for the factory floor that allow users to correlate multiple processes in a highly efficient approach to make wider process windows and total process control a reality. Miva Technologies has been very active in development through a span of products from PCB to microelectronics. For example, at the University of California’s Center for Environmental Implications of Nanotechnology we are now producing 2-micron line and space for additive technologies. The registration challenges we faced in substrate imaging were the catalyst to this new technology we will be introducing.
To read this entire interview, which appeared in the January 2021 issue of PCB007 Magazine, click here.
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).