The Knowledge Base: A Conference for Cleaning and Coating of Mission-critical Electronics
Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
IPC Releases IPC-7093A, Design and Assembly Process Implementation for BTCs
February 15, 2021 | IPCEstimated reading time: Less than a minute
The long-awaited release of IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs) is here. Revision A is a complete overhaul of IPC-7093 which provides design and assembly guidance for implementing BTCs and focuses on critical design, materials, assembly, inspection, repair, quality, and reliability issues.
IPC-7093A includes a step-by-step process on how to design and incorporate BTCs into any card layout. Comprehensive descriptions on how to successfully implement robust designs and assembly processes and troubleshooting guidance for common anomalies which can occur during BTC assembly are included.
Revision A adds state-of-the-art guidance on critical elements for thermal pad design, thermal via usage, stencil design, assembly recommendations, reliability considerations, known issues/ defects to avoid. The standard’s multiple design point options enable reliable BTC designs.
The standard is ideal for anyone involved with physical design, process and reliability engineers or managers who are responsible for design, assembly, inspection, and repair processes.
“BTCs are in integral part of electronic designs today,” stated Matt Kelly, IPC chief technologist. “With increased product functionality, device miniaturization, and increased power consumption the need for optimized thermal management has never been higher.”
Share on:
Suggested Items
Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design
07/10/2025 | I-Connect007In this special Meet the Author episode of the On the Line with… podcast, Nolan Johnson sits down with Martyn Gaudion, signal integrity expert, managing director of Polar Instruments, and three-time author in I-Connect007’s popular The Printed Circuit Designer’s Guide to... series.
Showing Some Constraint: Design007 Magazine July 2025
07/10/2025 | I-Connect007 Editorial TeamA robust design constraint strategy balances dozens of electrical and manufacturing trade-offs. This month, we focus on design constraints—the requirements, challenges, and best practices for setting up the right constraint strategy.
Elementary, Mr. Watson: Rein in Your Design Constraints
07/10/2025 | John Watson -- Column: Elementary, Mr. WatsonI remember the long hours spent at the light table, carefully laying down black tape to shape each trace, cutting and aligning pads with surgical precision on sheets of Mylar. I often went home with nicks on my fingers from the X-Acto knives and bits of tape all over me. It was as much an art form as it was an engineering task—tactile and methodical, requiring the patience of a sculptor. A lot has changed in PCB design over the years.
TTCI Joins Printed Circuit Engineering Association to Strengthen Design-to-Test Collaboration and Workforce Development
07/09/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its membership in the Printed Circuit Engineering Association (PCEA), further expanding the company’s efforts to support cross-functional collaboration, industry standards, and technical education in the printed circuit design and manufacturing community.
Bell to Build X-Plane for Phase 2 of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
07/09/2025 | Bell Textron Inc.Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 2 of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program with the objective to complete design, construction, ground testing and certification of an X-plane demonstrator.